Tag Archives: Xtensa

Tensilica Xtensa LX4 Dataplane Processing Unit IP Core

The Xtensa LX4 DPU (dataplane processing unit), from Tensilica, features local data memory bandwidth of up to 1024 bits per cycle, wider VLIW (very long instruction word) instructions up to 128 bits for increased parallel processing, and a cache memory prefetch option for reducing cycle counts. The base Xtensa LX4 DPU can reach speeds of over 1 GHz in 45 nm process technology (45GS) with an area of just 0.044 mm2. The configurable and extensible Xtensa LX4 DPU is available now. The IP core is ideal for handling complex compute-intensive DSP applications where an RTL implementation may be the only other option.

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Tensilica FLAC Decoder for the Xtensa HiFi Audio DSP

Tensilica’s HiFi Audio DSP family of IP (intellectual property) cores for SOC (system-on-chip) design now features the Free Lossless Audio Codec (FLAC) decoder. FLAC is an audio format similar to MP3, but lossless so the audio is compressed without any loss in quality. It is not a proprietary format. As a result, FLAC is not encumbered by patents, and has an open-source reference implementation. Tensilica’s FLAC decoder supports both stereo and multi-channel formats.

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Tensilica Third Generation Diamond Standard Controllers

Tensilica launched the third generation of their Diamond Standard controllers. The Diamond Standard processor cores is based on a common Xtensa architecture and provides the price/performance/low-power required for a wide range of embedded control functions in today’s compute-intensive dataplane functions. Improvements in this third generation of Diamond Standard controllers deliver up to 15% faster clock speed, up to 20% smaller die area and up to 15% less power consumption. The Diamond Standard processors are available now.

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CoWare-Tensilica Processor Support Package for Multi-Core Designs

CoWare and Tensilica teamed together to further enhance the integration of Tensilica’s processor models into the CoWare tools to support CoWare’s advanced functionality to ease software development on multi-core Tensilica-based SOC (system-on-chip) designs. The enhanced solution is being used by joint CoWare-Tensilica customers in automotive, consumer, and wireless markets. Tensilica Xtensa and Diamond Standard PSPs are available immediately from CoWare as part of the CoWare Model Library.

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Pin-level SystemC Models of Xtensa Customizable Dataplane Processors

Tensilica introduced pin-level SystemC models of the Xtensa customizable dataplane processors (DPUs). The pin-level models are a natural extension of Tensilica’s pre-existing transaction-level (TLM) Xtensa SystemC models (XTSC). They enable designers to conduct deep simulations of the interaction between the DPUs and special-function RTL (register-transfer-level) hardware blocks at a cycle-by-cycle pin-accurate level within their existing RTL simulators. The models also do not require the usage of any specialized hardware/software co-simulation tool.

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