Tag Archives: white paper

Non-Intrusive Board Bring-Up: Software Tools Ensure Fast Prototype Bring-Up White Paper

ASSET InterTech recently published a white paper titled: Non-Intrusive Board Bring-Up: Software Tools Ensure Fast Prototype Bring-Up. The technical paper explains how non-intrusive software tools can bring up prototype circuit boards faster than legacy hardware-oriented tools like oscilloscopes and logic analyzers. The white paper reviews best practices for board bring-up and describes the benefits of integrating non-intrusive tools based on embedded instruments into an organization’s board bring-up framework.

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White Paper: An Electrical-Thermal MMIC Design Flow

AWR recently published a white paper about the benefits of co-simulation. The title of the white paper is: An Electrical-Thermal MMIC Design Flow. The technical paper uses an actual design example to discuss the effectiveness of co-simulation between AWR’s Microwave Office high-frequency design software and CapeSym’s SYMMIC thermal analysis tool. An X-band RF power amplifier/low-noise amplifier MMIC for a transceiver application was designed in Microwave Office software and thermal coupling and other issues between the two circuits on the single die were quickly remedied with SYMMIC to produce optimum results.

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White Paper: Memory Subsystem Model for Evaluating Network-on-Chip Performance

Open Core Protocol International Partnership (OCP-IP) published a white paper titled “A Memory Subsystem Model for Evaluating Network-on-Chip Performance.” The technical paper discusses performance characteristics of DRAM memories that affect NoC evaluation. Work on the white paper was completed by the OCP-IP Network on Chip Benchmarking Working Group led by Tampere University of Technology and Sonics Inc.

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EMC Shielding Simplified White Paper

VTI Vacuum Technologies recently partnered with William D. Kimmel, PE (principal in the engineering consulting firm of Kimmel Gerke Associates) on a white paper that was written to educate people in related industries who aren’t familiar with how shielding works. The technical paper, EMC Shielding Simplified, explains the fundamentals of the EMC shielding process. The whitepaper discusses basic physics and concepts to ensure shielding effectiveness, as well as the shielding materials used. In addition, the artile details how to make shielding work properly, some typical shielding failures and how to solve those failures.

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White Paper: Cadence Design Systems Silicon Realization

Cadence Design Systems recently published a white paper on their new Silicon Realization approach. The technical paper explains how Silicon Realization is a fundamentally new approach to semiconductor design, verification, and implementation. Silicon Realization extends traditional EDA to cover both integration and creation. It unites functional, physical, and electrical concerns. It is also based on three emerging concepts: unified intent, higher abstraction levels, and convergence.

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White Paper: Advantages of Multi-rate Harmonic Balance Technology

AWR recently published a new white paper, The Advantages of Multi-rate Harmonic Balance Technology. To make harmonic balance analysis viable, AWR has pioneered a multi-rate harmonic balance (MRHB) technology within its APLAC family of harmonic balance and time-domain simulators. The capabilities provided with MRHB make it possible to solve entire complex subsystems such as mobile phone transceivers in a practical amount of time. The AWR white paper traces the use of harmonic balance in solving microwave problems, describes MRHB technology, and provides examples of its effectiveness when compared with traditional harmonic balance simulators.

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White Paper: World’s Smallest OSGi Solution

ProSyst recently ported their OSGi solution (ProSyst mBS) to an embedded low power hardware with an ARM9 CPU at 156 MHz and 8 MB RAM and flash memory. ProSyst mBS, is fully compliant and certified for OSGi revision 4.2. The OSGi framework provides sufficient resources for applications and services. It meets all non-functional requirements of a mass-market automotive telematics system. The OSGi framework also qualifies for optimal use in many other embedded markets, such as the home automation space. ProSyst published a white paper titled, The World’s Smallest OSGi Solution that their describes their automotive project.

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COM Express for Harsh Environments White Paper

GE Intelligent Platforms recently published a white paper titled, COM Express for Harsh Environments. The white paper describes how design innovation of COM technology can expand its reach beyond low-stress environments and into more rugged conditions. The GE COM Express white paper discusses key considerations in selecting a COM Express module specifically designed for harsh environments to meet rugged application needs.

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White Paper: Tilted Elliptical Dirac Cones at a Half-metal Surface

The Department of Chemistry at the University of Cambridge recently published a paper in Physical Review B. The article is titled, Tilted Elliptical Dirac Cones at a Half-metal Surface. The paper, written by Dr. Stephen Jenkins, highlights the novel electronic properties of an alloy. The half-metallic alloy NiMnSb exhibits properties previously only observed in graphene and topological insulators. Electrons confined near the surfaces and interfaces of NiMnSb are constrained to move according to a conical energy-momentum relationship (the so-called “Dirac cone”) and have no effective mass, meaning these surfaces exhibit the exotic properties associated with effectively mass-less electrons. This includes properties which could allow us to manipulate electrons and “holes”, which presents new opportunities in semiconductor electronics.

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Integrating Bluetooth Capability into Your Design White Paper

Jungo published a new white paper this week. It’s titled, “Integrating Bluetooth Capability into Your Design.” The technical paper examines the increasingly ubiquitous role of bluetooth in short-range wireless data transfer and describes how the complexity of the protocol could pose a significant learning and development curve for device manufacturers.

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