Avnet Electronics Marketing Americas will hold their annual Power Forum next month. The virtual forum will feature over 30 webinars. The technical webcasts offer practical, solutions-based training for design engineers. The virtual event will start at midnight EDT on September 19, 2012. The Avnet Power Forum is free. Registration is open now for the 24-hour event.
Avnet Electronics Marketing Americas announced the Smart Energy Forum. The online event will cover the latest smart energy technologies. Avnet’s Smart Energy Forum will discuss a range technologies and applications, from those that generate, convert and control energy, to the communications technologies used in applications that monitor and manage energy in consumer and industrial settings. The virtual event will feature sessions presented by Fairchild Semiconductor, Freescale Semiconductor, NXP Semiconductors and STMicroelectronics. The forum takes place on Wednesday, May 16 and registration is free.
Digi-Key and Microchip Technology will host a free virtual event on Tuesday, November 2, from 7 am to 3 pm PST. The Virtual Embedded Designers Forum is a live, one-day online event for software and hardware engineers looking to monitor, measure, control, display, convert or use energy more efficiently using the latest technologies and products to help design Smart Energy products. The Virtual Embedded Designer’s Forum (EDF) features twelve presentations (including keynote presentations from Energizer and Google PowerMeter), interactive chats, and a virtual exhibit hall where attendees will gain access to a comprehensive collection of educational materials and resources.
Avnet Electronics Marketing Americas (EMA) announced their Power Forum. The virtual conference offers practical, how-to training on power electronics design for engineers. The online event will take place September 22-23, 2010 from 11 am to 5 pm (EDT). Power Forum consists of the virtual Training Center and Application Center. The Training Center features over 30 on-demand presentations and videos focusing on power design techniques and solutions. The Application Center contains a large selection of selector guides, datasheets, whitepapers, and videos in the areas of renewable, portable devices, light-emitting diode (LED) lighting and industrial, communications and computing power.
Synopsys will host an online synposium from August 31st to September 2nd. The virtual event will feature Synopsys’ EDA software, IP, prototyping, and services for semiconductor design, verification and manufacturing. During the event, engineers can chat with Synopsys technical staff and view product demos, webinars, and technical papers. Designers can view synposium materials on-demand through December 3, 2010.
PROLITH X3.1, from KLA-Tencor, is a comprehensive toolset that addresses advanced lithography challenges. PROLITH X3.1 virtual lithography tool helps researchers quickly and cost-effectively troubleshoot challenging issues in EUV and double patterning lithography (DPL) processes, including line edge roughness (LER) and patterning issues associated with wafer topography. With PROLITH X3.1, lithographers can streamline research, conserve valuable lithography cell resources, and accelerate product development.
CoWare announced the Versatile Virtual Reference Board with access provided through Software as a Service (SaaS). The Virtual Platform is a soft emulator of the ARM RealView Versatile Platform Baseboard for ARM926-EJS provided for educational purposes only. It includes a virtualized Ethernet Controller, UARTs, keyboard and mouse interfaces, and a frame-buffer console that enables designers to interact with the platform. The packages come with a complete Linux software stack, including kernel and file-system. A comprehensive user’s guide introduces the usage of virtual platforms for embedded software development.
Carbon Design Systems and VeriSilicon have integrated VeriSilicon’s ZSP models into the Carbon SoC Designer virtual platform. VeriSilicon processors enable users to perform implementation-accurate architectural analysis and pre-silicon firmware development. The VeriSilicon ZSP integration is available now from Carbon Design Systems.
CoWare and Tensilica teamed together to further enhance the integration of Tensilica’s processor models into the CoWare tools to support CoWare’s advanced functionality to ease software development on multi-core Tensilica-based SOC (system-on-chip) designs. The enhanced solution is being used by joint CoWare-Tensilica customers in automotive, consumer, and wireless markets. Tensilica Xtensa and Diamond Standard PSPs are available immediately from CoWare as part of the CoWare Model Library.