Tag Archives: VIA

IDC Worldwide PC Microprocessor 3Q10 Stats

According to International Data Corporation (IDC), worldwide PC microprocessor unit shipments and revenues in the third calendar quarter of 2010 (3Q10) increased 2.1% and 2.5%, respectively, compared to 2Q10. Worldwide PC microprocessor unit shipments and revenues in the third calendar quarter of 2010 (3Q10) increased 8.6% and 24.1%, respectively, compared to the third quarter of 2009. The findings were published in IDC’s latest PC processor study, Worldwide PC Microprocessor 3Q10 Vendor Shares.

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VIA AMOS-5000 Series Device Development Kits

VIA Technologies introduced the AMOS-5000 series device development kits for designing application-specific and fanless Em-ITX-based systems. VIA AMOS-5000 series development kits combine application specific VIA EM-IO expansion modules with specially designed extendable aluminum chassis kits. This enables embedded systems engineers to develop a variety of fanless embedded box systems for a range of applications. VIA AMOS-5000 series development kits are available now.

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