Tag Archives: TSV

2010 International Symposium on Quality Electronic Design

The 2010 International Symposium on Quality Electronic Design (ISQED2010) conference will feature nine multiple interactive tutorials covering challenging design issues. ISQED2010 features 7 keynote speeches by industry leaders, 23 technical sessions with nearly 150 papers in three parallel tracks, panel discussions and vendor exhibits. The conference will take place March 22-24, 2010, at the Doubletree Hotel, San Jose, Calif.

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SEMATECH Knowledge Series Conferences 2010

The 2010 SEMATECH Knowledge Series (SKS) conferences will focus on difficult questions in lithography, advanced technologies, manufacturing, and strategy. Included are a new set of meetings on installed-base equipment utilization, and a new interconnect workshop in stress management for 3D chips utilizing through-silicon vias (TSVs). All SKS meetings are open to the public.

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