Tag Archives: Toshiba

e-MMC based Embedded Memory Architectures Webinar

Toshiba America Electronic Components (TAEC) and Denali Software are offering a webinar titled, eMMC-based Memory Architectures: Trends, Design Considerations and Trade-offs. The webcast will review the new features of eMMC v4.4, and discuss how it can be integrated into mobile phones or other CE device in multiple ways such as a discrete eMMC device, a DRAM+SLC+eMMC multi chip package (MCP), DRAM + eMMC MCP or a package on package (POP) stacked device.

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