Tag Archives: through-silicon

SEMATECH Knowledge Series Conferences 2010

The 2010 SEMATECH Knowledge Series (SKS) conferences will focus on difficult questions in lithography, advanced technologies, manufacturing, and strategy. Included are a new set of meetings on installed-base equipment utilization, and a new interconnect workshop in stress management for 3D chips utilizing through-silicon vias (TSVs). All SKS meetings are open to the public.

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