Tag Archives: Thermal

Mentor Graphics Offers JESD51-14 Compliant Thermal Characterization Solution

Mentor Graphics introduced an integrated solution for thermal characterization and simulation. The integrated solution features their T3Ster hardware test products with their FloTHERM software. The Mentor Graphics integrated T3Ster and FloTHERM solution helps accurate thermal simulation models. The thermal characterization solution is the only JESD51-14 compliant solution available on the market today. The integrated solution for efficient thermal package characterization is available now.

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Docea Power Aceplorer 2.0 and AcePowerModeler

Docea Power introduced Aceplorer 2.0 and AcePowerModeler. Aceplorer is a system-level power and thermal modeling tool. AcePowerModeler is a power model generator tool that closes the loop between implementation and architectural modeling by automating the creation of power models from lower level simulation and characterization data. Aceplorer 2.0 is available now. AcePowerModeler is available now for select customers, and will be released in Q4. It can be used with Aceplorer or stand alone.

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Digital Prototyping in a Flow and Thermal World Webinars

Blue Ridge Numerics announced two live webinars on Digital Prototyping in a Flow and Thermal World. The first webcast will take place on Wednesday, April 28, 2010, at 11:00 a.m. ET and cover the importance of flow and thermal simulations from within the CAD environment. The second online seminar will place on Thursday, April 29, at 12:00 noon ET and will cover the importance of thermal simulations from within the CAD environment with a focus on the LED lighting industry.

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Mentor Graphics FloTHERM IC for Thermal Characterization

Mentor Graphics introduced the FloTHERM IC productivity tool for thermal characterization and design. The FloTHERM IC solution is deployed as a web-based platform that delivers a high level of automation to the design tasks associated with full-spectrum thermal characterization and validation. FloTHERM IC makes it convenient for experts and non-experts to access the technology online, quickly build a model from the libraries and test their performance. As a result, thermal experts can focus on solving difficult semiconductor packaging thermal problems and mission-critical issues instead of fulfilling routine requests.

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Sigrity PowerDC Thermal Simulation and Analysis Software

Sigrity introduced PowerDC Thermal analysis software. PowerDC Thermal eliminates manual iterations between simulations with separate electrical and thermal tools, reduces time, and improves results convergence. It is ideal for avoiding field failures. PowerDC with DC analysis, thermal analysis, and co-simulation capability is available on Windows and Linux platforms. Annual prices start at $30,000. PowerDC Thermal also is available as an added option for currently licensed Sigrity PowerDC users. It adds thermal analysis and co-simulation to the present DC analysis capability. Annual prices start at $15,000.

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