Tag Archives: Thermal Analysis

White Paper: An Electrical-Thermal MMIC Design Flow

AWR recently published a white paper about the benefits of co-simulation. The title of the white paper is: An Electrical-Thermal MMIC Design Flow. The technical paper uses an actual design example to discuss the effectiveness of co-simulation between AWR’s Microwave Office high-frequency design software and CapeSym’s SYMMIC thermal analysis tool. An X-band RF power amplifier/low-noise amplifier MMIC for a transceiver application was designed in Microwave Office software and thermal coupling and other issues between the two circuits on the single die were quickly remedied with SYMMIC to produce optimum results.

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Mentor Graphics FloTHERM 9 3D Computational Fluid Dynamics Software

Mentor Graphics introduced version nine of their FloTHERM 3D computational fluid dynamics (CFD) software for electronics cooling applications. FloTHERM v.9 features Bottleneck (Bn) and Shortcut (Sc) fields that help engineers identify where heat flow congestion occurs in the electronic design and why. It also identifies thermal shortcuts to quickly and efficiently resolve the design problem. Bn and the Sc fields elevate the use of simulation from an observation tool to a thermal design problem-solving tool. The FloTHERM v.9 product is available now.

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