This year’s DATE 2011 conference will feature two educational technical workshops hosted by Apache Design Solutions. The Chip-Package-System Methodology from Early Stage to Sign-off workshop will take place on March 15th. The Power Methodology for Energy Efficient Designs workshop will take place March 16th. Apache Design Solutions will also present two technical papers at DATE: Ball Grid Array Packages Electrical Optimization Using Apache Package Modeling Tools and System Level Power Integrity Analysis and Supply Network Optimization of a Dual Core CPU.
At the IEEE International Electron Devices Meeting (IEDM), engineers from SEMATECH’s Front End Processes (FEP) program will present technical papers revealing research breakthroughs. SEMATECH experts will report on low defect density high-k gate stacks for alternative III-V channel materials and non-planar devices, and discuss a new dry etch approach to minimize etch related leakage — a significant process technology advancement for next-generation logic and memory technologies. The IEDM Conference will take place December 7-9, 2009, at the Hilton in Baltimore, MD.