AWR published a new application note. The article explains how to complement Microwave Office circuit design software with National Instrument’s Multisim circuit simulation software and Ultiboard printed circuit board (PCB) layout software for a comprehensive design flow spanning from DC to microwave frequencies. The title of the technical paper is Multisim/Ultiboard for Low-Frequency Simulation and Layout.
AWR published a white paper about correctly predicting cellular, radar, or satellite RF link performance early in the design cycle. The article highlights the advantages of using Visual System Simulator (VSS) RF system simulation software for detailed insight into the full performance of an RF link in next-generation wireless products. The title of the technical paper is: Understanding and Correctly Predicting Critical Metrics for Wireless RF Links.
DesignCon 2013 will feature over 100 in-depth tutorials, technical paper sessions, panel discussions, presentations and an educational forum. The two-day event is ideal for engineers in the chip, board and systems design community. DesignCon 2013, which is hosted by UBM Electronics, will take place January 28-31 in Santa Clara, California. Early bird pricing for the conference, which provides registrants with $250 in savings, ends on Friday, December 7, 2012.
ASSET InterTech recently published a white paper titled: Non-Intrusive Board Bring-Up: Software Tools Ensure Fast Prototype Bring-Up. The technical paper explains how non-intrusive software tools can bring up prototype circuit boards faster than legacy hardware-oriented tools like oscilloscopes and logic analyzers. The white paper reviews best practices for board bring-up and describes the benefits of integrating non-intrusive tools based on embedded instruments into an organization’s board bring-up framework.
AWR recently published a white paper about the benefits of co-simulation. The title of the white paper is: An Electrical-Thermal MMIC Design Flow. The technical paper uses an actual design example to discuss the effectiveness of co-simulation between AWR’s Microwave Office high-frequency design software and CapeSym’s SYMMIC thermal analysis tool. An X-band RF power amplifier/low-noise amplifier MMIC for a transceiver application was designed in Microwave Office software and thermal coupling and other issues between the two circuits on the single die were quickly remedied with SYMMIC to produce optimum results.
ProSyst recently ported their OSGi solution (ProSyst mBS) to an embedded low power hardware with an ARM9 CPU at 156 MHz and 8 MB RAM and flash memory. ProSyst mBS, is fully compliant and certified for OSGi revision 4.2. The OSGi framework provides sufficient resources for applications and services. It meets all non-functional requirements of a mass-market automotive telematics system. The OSGi framework also qualifies for optimal use in many other embedded markets, such as the home automation space. ProSyst published a white paper titled, The World’s Smallest OSGi Solution that their describes their automotive project.
AWR Corporation published a new system planning white paper. The AWR white paper outlines the benefits of using a commercial, specialized software program such as Visual System Simulator (VSS) for end-to-end system design, while also embracing legacy approaches with the incorporation of spreadsheet views. The technical paper is available now for AWR.