Tag Archives: TCAD

Imec and Synopsys to Accelerate 3D Stacked IC Development

Synopsys and imec will collaborate to accelerate the development of 3D stacked IC technologies. Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools will be used for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs). The collaboration will accelerate the development of 3D stacked IC technologies.

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