The Silicon Integration Initiative will co-locate their OpenAccess Scripting Language Workshop at the Design Automation Conference. The Si2 workshop will be will be held on June 6, from 1:00 pm – 4:30 pm in Room 29AB in the San Diego Convention Center. Si2 is offering the OpenAccess Scripting Language Workshop free of charge. The DAC workshop is intended for chip design engineers who want to interact with OpenAccess programs or data in scripting languages (such as Tcl, Perl, Python, Ruby), either integrated with native C++ code or as stand-alone programs.
The Design for Manufacturability Coalition (DFMC) have approved the first official release of the OpenDFM 1.0 standard. OpenDFM is an open, high-level DRC language that can generate verification languages with no loss of accuracy or performance. OpenDFM utilizes a more compact notation for physical verification than traditional DRC rules. Tests show OpenDFM can reduce the volume of DRC rules by 5x-20x. OpenDFM describes verification intent for leading process nodes, including conditional rules and ranges of acceptable values. It leverages a plug-in architecture to automatically generate output decks.
The Silicon Integration Initiative (Si2) will hold their annual OpenAccess+ Conference on October 20, 2010 in Santa Clara, CA. The Si2 OpenAccess+ Conference will cover the inter-related areas of OpenAccess, Design for Manufacturability (DFM), Low Power design and the newest Coalition for Open PDKs. The event will include a DFM session on the OpenDFM meta language standard, which describes DRC and DFM checks in a tool-agnostic fashion. The conference will provide updates on the industry adoption of OpenAccess and plans for the future for all coalitions.
The 3-D Architectures for Semiconductor Integration and Packaging Conference will take place December 9-11, 2009, at the Hyatt Regency San Francisco Airport in Burlingame, CA. This year’s conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry. At the conference, Si2 will present the findings from a recent 3D Standards workshop hosted by Si2 and GSA.