Tag Archives: RedHawk-3DX

Apache to Host Low Power Webinar Series

Apache Design announced four online seminars for this month. The webcasts will cover simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics. The Apache Low Power Webinar Series will take place July 24, July 25, July 26, and July 31.

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ANSYS Introduces RedHawk-3DX 20nm Power Sign-off Solution

RedHawk-3DX GUI showing multiple die with silicon interposer

ANSYS launched RedHawk-3DX, which is a fourth-generation power sign-off solution. RedHawk-3DX is designed to meet the power, performance and price demands of low-power mobile, high-performance computing, consumer and automotive electronics. RedHawk-3DX extends previous generations’ capabilities to address sub-20 nanometer (nm) designs with 3+ gigahertz performance and billions of gates. It is also architected to support the simulation of emerging chip and packaging technologies using multi-die three-dimensional ICs (3D-ICs) for smart electronic products.

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