Jasper Design Automation announced Intelligent Proof Kits for accelerated certification of advanced SoC interconnect protocols. Jasper Intelligent Proof Kits ship unencrypted with original source code to facilitate user customization and insights into the protocols themselves. Jasper is initially releasing Intelligent Proof Kits for AMBA 3 and AMBA 4. DFI, DDR and LPDDR versions will roll out a little later.
ARM unveiled the first phase of the new AMBA 4 specification. The AMBA specification is the de facto standard for system on-chip interconnects. The AMBA 4 increases functionality and efficiency for complex, media-rich on-chip communication. The AMBA 4 specification has been designed by and for the industry with contributions from 35 of the industry’s leading OEM, semiconductor, and EDA vendors.
Jasper Design Automation rolled out Proof Kits for LPDDR1 and LPDDR2, and DDR3 SDRAM. The new LPDDR and DDR3 Proof Kits both speed verification for these high-demand memories, and ensure conformance with industry standards. The new DDR Proof Kits are currently available as a chapter within Jasper Formal Testplanner, and provided at no additional charge to current licensees of Formal Testplanner.