Tag Archives: Power Analysis

Apache Design Sponsors Two DesignCon Chip Package System Workshops

Apache Design, Inc. is sponsoring two Chip-Package-System (CPS) workshops at DesignCon 2012. The two in-depth technical workshops will provide designers with an open forum for exchanging the latest ideas and information on the most current technologies. In the interactive workshops, leading semiconductor companies and system houses will share perspectives and best practices on chip and package modeling, and system-level verification for signal integrity, power integrity, electromagnetic interference and thermal. The workshops are free. However, seating is limited and registration is required.

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European SystemC User Group 2009

The European SystemC User Group (ESCUG) will host a meeting on December 1, 2009 in Grenoble, France. For the first time, the meeting will be co-located with IP-ESC 2009 (IP-Embedded Systems Conference), which is a technical conference focused on intellectual property (IP) based system-on-chip (SoC) design. SystemC continues to grow in importance for architectural exploration, performance analysis, building virtual platforms for software development, and functional verification.

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