Tag Archives: Packaging

3D Architectures for Semiconductor Integration and Packaging Conference

The 3-D Architectures for Semiconductor Integration and Packaging Conference will take place December 9-11, 2009, at the Hyatt Regency San Francisco Airport in Burlingame, CA. This year’s conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry. At the conference, Si2 will present the findings from a recent 3D Standards workshop hosted by Si2 and GSA.

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