Toshiba America Electronic Components (TAEC) and Denali Software are offering a webinar titled, eMMC-based Memory Architectures: Trends, Design Considerations and Trade-offs. The webcast will review the new features of eMMC v4.4, and discuss how it can be integrated into mobile phones or other CE device in multiple ways such as a discrete eMMC device, a DRAM+SLC+eMMC multi chip package (MCP), DRAM + eMMC MCP or a package on package (POP) stacked device.
Evatronix is offering a day full of free technical seminars on December 2nd. The seminars will be held at IP-ESC 2009 (IP-Embedded Systems Conference). Their seminar topics include SuperSpeed USB 3.0, choosing NAND flash, SuperSpeed USB 3.0 IP verification, USB 3.0 mass dtorage spplication, and NAND Flash memories status. Evatronix will also showcase their USB 3.0 Device Controller in their booth.