Tag Archives: High-Frequency

White Paper: An Electrical-Thermal MMIC Design Flow

AWR recently published a white paper about the benefits of co-simulation. The title of the white paper is: An Electrical-Thermal MMIC Design Flow. The technical paper uses an actual design example to discuss the effectiveness of co-simulation between AWR’s Microwave Office high-frequency design software and CapeSym’s SYMMIC thermal analysis tool. An X-band RF power amplifier/low-noise amplifier MMIC for a transceiver application was designed in Microwave Office software and thermal coupling and other issues between the two circuits on the single die were quickly remedied with SYMMIC to produce optimum results.

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High-Frequency Design Success Seminars

AWR announced the High-Frequency Design Success seminar tour for the Asia-Pacific region. The seminars feature application-specific presentations such as radar systems design, wireless communication system design, and RF board design and flow. The seminars will be presented by AWR Korea with partners Rohde & Schwarz (China) and ACE Solution (Taiwan).

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AWR Analog Office 2009 for High Frequency Analog and RFIC Design

AWR launched Version 2009 of their Analog Office high-frequency analog and RFIC design software. Analog Office Version 2009 includes AWR’s patent-pending multi-rate harmonic balance (MRHB) technology, which increases the speed and reduces the computer memory required to perform steady-state analysis of complex multi-tone designs such as those found in receivers and transmitters with multiple stages of upconversion and downconversion.

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