PROLITH X3.1, from KLA-Tencor, is a comprehensive toolset that addresses advanced lithography challenges. PROLITH X3.1 virtual lithography tool helps researchers quickly and cost-effectively troubleshoot challenging issues in EUV and double patterning lithography (DPL) processes, including line edge roughness (LER) and patterning issues associated with wafer topography. With PROLITH X3.1, lithographers can streamline research, conserve valuable lithography cell resources, and accelerate product development.
At SPIE Advanced Lithography 2010, SEMATECH will discuss issues and solutions in preparing extreme ultraviolet lithography (EUVL) for high-volume manufacturing. The SPIE Advanced Lithography conference will take place February 21-25 in San Jose, CA. SEMATECH will show how they are enabling EUV mask and resist/materials infrastructure as well as EUVL manufacturing feasibility and affordability. The SEMATECH Lithography Program is based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex.