Tag Archives: EDA360

Cadence Digital End-to-end Flow for 28nm Giga-gate/Gigahertz Designs

Cadence Design Systems announced a 28nm digital end-to-end design flow based on Encounter. The digital 28-nanometer flow provides a faster, more deterministic path to achieve giga-gate/gigahertz silicon through technology integration and significant core architecture and algorithm improvements in a unified design, implementation and verification flow. The new Encounter-based flow enables designers to consider the entire chip flow holistically. It supports Cadence’s approach to Silicon Realization, which is a key element of the EDA360 vision. The new flow is available now.

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Cadence to Present at ARM Technical Conference 2010

Cadence Design Systems will presenting at the ARM Technical Conference (TechCon) 2010. John Bruggeman (Cadence Chief Marketing Officer and Senior Vice President) will participate in a chat with Simon Segars (ARM executive vice president and general manager of the Physical IP Division). The chat, The Electronics Industry is Evolving, will discuss how ARM and Cadence are playing key roles in leading the revolution in innovative products and approaches to design. The chat session will take place from 5:00 p.m. to 5:45 p.m. on Tuesday, Nov. 9, 2010. Cadence will also present several technical sessions and papers at the ARM conference. The ARM Technology Conference will take place at the Santa Clara Convention Center November 9-11, 2010.

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Cadence Silicon Realization Webinars

Cadence Design Systems is offering a series of silicon realization webinars. The webcasts will present new approaches to improving productivity, predictability, and profitability. Attendess will learn how to maximize investment in the UVM, find out how to achieve a predictable and convergent path to closure, learn how to eliminate bugs with formal verification, and enhance design team collaboration. All the online seminars will take place from 10am-11am PST.

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Cadence Digital Implementation and Signoff Webinars

Cadence Design Systems is offering a series of EDA360 webinars. The digital implementation and signoff webcasts will present the latest approaches to realizing silicon, productively and profitably. The first online event, Getting Back Timing Margins: Traditional OCV Alternatives, starts today at 10am Pacific time. EDA360 supports both design creators and integrators.

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