Tag Archives: Digital

Silicon Laboratories Introduces Class D ToolStick Evaluation Kit

Silicon Laboratories Class D ToolStick evaluation kit

Silicon Laboratories released their Class D ToolStick evaluation kit. The evaluation kit enables developers to add digital Class D audio capabilities to 32-bit embedded designs based on Silicon Labs’ feature-rich SiM3U1xx Precision32 microcontrollers (MCUs). The Class D ToolStick evaluation kit includes full source code and implements a Class D amplifier demonstration using a small-footprint 40-pin 6 mm x 6 mm package SiM3U1xx MCU. The USB-based kit is available now. It is priced at $35.

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ProPlus Design Solutions Debuts NanoYield Design for Yield Software

ProPlus Design Solutions launched NanoYield design for yield software. It is a fast and accurate yield prediction and optimization tool for memory, logic, analog and digital circuit design. The toolset is faster than traditional Monte Carlo analysis for both regular three-sigma and advanced six-sigma analysis. NanoYield is part of ProPlus Design Solutions’ transistor-level statistical modeling and design and variations-aware product portfolio. It is shipping now.

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Cadence Design Systems, Samsung Electronics Team on 20nm Design Methodology

Cadence Design Systems and Samsung Electronics teamed together on a 20-nanometer design methodology. Their 20nm digital design methodology features double patterning technology for joint customer deployment and internal test chips. The new design methodology enables design at 20 nanometers and future process nodes. It is ideal for mobile consumer electronics.

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Rigol Technologies Introduces DSA815 Spectrum Analyzer

Rigol Technologies DSA815 spectrum analyzer

Rigol Technologies launched their DSA815 spectrum analyzer. The DSA815 features all-digital IF technology, highly precise amplitude readings, frequency range of 9kHz to 1.5 GHz, compact design and easy-to-use interface. The DSA815 is easy to use and highly reliable. The Rigol DSA815 spectrum analyzer is available now. Prices start at $1,295. It is ideal for demanding benchtop or field applications in RF and wireless testing and production.

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Mantracourt Digital Strain Gauge to USB Convertor

Mantracourt introduced the Strain Gauge to USB Converter (DSCUSB). The Strain Gauge to USB Converter is a digital signal conditioner with USB connectivity. It converts a strain gauge sensor input to a digital USB serial output. The DSCUSB is targeted at applications requiring high accuracy measurement. The DSCUSB is ideal for all strain gauge bridge based sensors, such as strain, weight, load, force, torque, pressure and displacement. Mantracourt also offers the digital strain gauge in an OEM format for companies looking to integrate the DSCUSB into their own systems.

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Cadence Digital End-to-end Flow for 28nm Giga-gate/Gigahertz Designs

Cadence Design Systems announced a 28nm digital end-to-end design flow based on Encounter. The digital 28-nanometer flow provides a faster, more deterministic path to achieve giga-gate/gigahertz silicon through technology integration and significant core architecture and algorithm improvements in a unified design, implementation and verification flow. The new Encounter-based flow enables designers to consider the entire chip flow holistically. It supports Cadence’s approach to Silicon Realization, which is a key element of the EDA360 vision. The new flow is available now.

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Digital Prototyping in a Flow and Thermal World Webinars

Blue Ridge Numerics announced two live webinars on Digital Prototyping in a Flow and Thermal World. The first webcast will take place on Wednesday, April 28, 2010, at 11:00 a.m. ET and cover the importance of flow and thermal simulations from within the CAD environment. The second online seminar will place on Thursday, April 29, at 12:00 noon ET and will cover the importance of thermal simulations from within the CAD environment with a focus on the LED lighting industry.

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2010 Agilent Measurement Forum Asia Tour

The theme of the 2010 Agilent Measurement Forum Asia tour is Powering Collaboration and Innovation in Wireless and Digital Arenas. The Agilent tour will start in Shanghai on April 13, with additional stops in Beijing and Shenzhen, China. Other tour locations include Taiwan (Taipei and HsinChu), South Korea (Seoul), India (Bangalore and New Delhi), Malaysia (Penang), and Singapore.

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DM365 Digital Media System-on-Chip On-Ramp Technical Session

Avnet Electronics Marketing introduced an On-Ramp Technical Session that features the TMS320DM365 DaVinci video system-on-chip (SoC) from Texas Instruments (TI). The TI TMS320DM365 DaVinci is a single-chip ARM processor capable of capturing, encoding, decoding and displaying high definition (HD) video. The DM365 DaVinci On-Ramp session is available free of charge in North America upon request.

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Averant Solidify 5.2

Averant introduced Solidify 5.2. The latest version of Solidify features accelerated analysis with multi-core computers, new Auto Check technology, and enhanced sequential equivalency checking (SEC). Release 5.2 is available immediately. Averant is a leader in property verification of RTL designs for digital integrated circuits.

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