Tensilica announced their HiFi Mini DSP IP core. According to the company, the digital signal processor core is the smallest, lowest power DSP IP core supporting always listening voice trigger and speech command modes. The HiFi Mini DSP IP core will be available in March 2013. The core is ideal for smartphones, tablets, appliances, and automotive applications.
Texas Instruments announced the Audio Capacitive Touch BoosterPack, which is based on the C5000 ultra-low-power digital signal processor (DSP). The C5000 ultra-low-power DSP-based Audio Capacitive Touch BoosterPack is a plug-in board for the MSP430 LaunchPad development kit. The TI Audio Capacitive Touch BoosterPack is available now for a one-time promotional price of $30 USD for the next 30 days (normally priced at $34.99).
Tensilica introduced the HiFi 3 audio/voice digital signal processor intellectual property core for system-on-chip design. HiFi 3 DSP has an 80% increase in performance for the FFT (fast Fourier transform), FIR (finite impulse response), and IIR (infinite impulse response) math functions that are essential in audio pre- and post-processing. In addition, there’s a performance improvement of over 150% for most voice codecs compared to HiFi EP. The HiFi 3 has been delivered to lead customers. General availability will be in March.
Tensilica announced Revision C of the ConnX 545CK 8-MAC (multiply-accumulate) VLIW (very long instruction word) DSP (digital signal processor) core for system-on-chip (SOC) designs. In 65GP optimized for high speed, the ConnX 545CK delivers over 600 MHz operation. The third generation dataplane processor (DPU) core deliver up to 20% faster clock speed, 11% smaller die and up to 30% lower power consumption. The ConnX 545CK Revision C is available now.
Texas Instruments (TI) introduced the TMS320C5515 Fingerprint Development Kit for integrating of fingerprint biometric features into embedded systems. The C5515 Fingerprint Development Kit features a core board based on TI’s C5515 digital signal processor (DSP), two widely-used sensor types (swipe and optical), and optimized application software to ease product creation and implementation. The kit can reduce the product design cycle by 9 to 12 months. The TI TMS320C5515 fingerprint is priced at $79 USD.