VIA Technologies introduced the AMOS-5000 series device development kits for designing application-specific and fanless Em-ITX-based systems. VIA AMOS-5000 series development kits combine application specific VIA EM-IO expansion modules with specially designed extendable aluminum chassis kits. This enables embedded systems engineers to develop a variety of fanless embedded box systems for a range of applications. VIA AMOS-5000 series development kits are available now.
AWR Corporation published a new white paper, entitled X-parameters and Beyond, AWR’s Support of PHD and Nonlinear Behavioral Models. The white paper provides comprehensive information about rapidly-emerging nonlinear models and measurement systems and how AWR’s Microwave Office high-frequency design software effectively employs them.
Avnet Electronics Marketing introduced the first of three technical training sessions for medical device manufacturers featuring design solutions from Analog Devices. The first training features two On-Ramp Technical Sessions that showcase the benefits of utilizing Analog Devices’ signal processing ICs for diagnosis level electrocardiogram (ECG) measurement equipment and pulse oximetry design applications.
Measurement Computing Corporation announced the USB-2001-TC thermocouple device for OEM applications. The USB-2001-TC is the third thermocouple device in OS-independent DAQFlex line of products designed for the DAQFlex protocol. The USB-2001-TC unit is 0.8 high by 1.5 wide by 2.5 inches long. It has a captive 2 meter-long USB cable attached to one end and a socket on the other end for receiving industry-standard thermocouple miniplugs. The USB-2001-TC gets power from the host PC via the USB cable, and requires no external supply.
At the IEEE International Electron Devices Meeting (IEDM), engineers from SEMATECH’s Front End Processes (FEP) program will present technical papers revealing research breakthroughs. SEMATECH experts will report on low defect density high-k gate stacks for alternative III-V channel materials and non-planar devices, and discuss a new dry etch approach to minimize etch related leakage — a significant process technology advancement for next-generation logic and memory technologies. The IEDM Conference will take place December 7-9, 2009, at the Hilton in Baltimore, MD.
Agilent Technologies released the test procedures for physical and protocol-layer device testing according to the Serial ATA International Organization: Serial ATA (SATA) Revision 3.0 standard. The SATA Revision 3.0 standard defines a maximum transfer speed of 6.0 Gb/s, which is double the speed of previous-generation technology. Faster transfer speeds enable higher-performance storage for applications such as emerging solid-state drives and enterprise business storage. This new specification will enable users to move large quantities of data at faster rates, which is increasingly critical for today’s high-resolution photos, videos, music, and multimedia files.