Toshiba America Electronic Components (TAEC) and Denali Software are offering a webinar titled, eMMC-based Memory Architectures: Trends, Design Considerations and Trade-offs. The webcast will review the new features of eMMC v4.4, and discuss how it can be integrated into mobile phones or other CE device in multiple ways such as a discrete eMMC device, a DRAM+SLC+eMMC multi chip package (MCP), DRAM + eMMC MCP or a package on package (POP) stacked device.
Denali Software has an archived webinar about verification: Advanced Verification with OVM and PureSpec. The on-demand webcast explains how to maximize productivity in an Open Verification Methodology (OVM) environment. The webinar will highlight various OVM and PureSpec features and give examples of how to implement these various attributes into a full-scale verification environment.