Tag Archives: DATE

Apache Design Solutions Technical Workshops and Papers at DATE 2011

This year’s DATE 2011 conference will feature two educational technical workshops hosted by Apache Design Solutions. The Chip-Package-System Methodology from Early Stage to Sign-off workshop will take place on March 15th. The Power Methodology for Energy Efficient Designs workshop will take place March 16th. Apache Design Solutions will also present two technical papers at DATE: Ball Grid Array Packages Electrical Optimization Using Apache Package Modeling Tools and System Level Power Integrity Analysis and Supply Network Optimization of a Dual Core CPU.

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2011 Design, Automation & Test in Europe (DATE) Conference

The Design, Automation & Test in Europe Conference features technical presentations, tutorials, panel discussions and user testimonials. DATE 2011 event includes dedicated areas for system level design, hardware design/electronic design automation, robust design and yield, and working silicon hardware prototypes and applications. The DATE 2011 Conference and Exhibition will take place March 14-18th in Grenoble, France.

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European SystemC User Group Meeting

The Open SystemC Initiative (OSCI) announced the annual European SystemC User Group (ESCUG) meeting. ESCUG will take place Tuesday, March 9, 6:30 pm – 9:30 pm. The meeting will be co-located with the Design, Automation & Test in Europe (DATE) Conference. The event is free to industry professionals and the media. The Open SystemC Initiative (OSCI) is an independent, non-profit organization dedicated to supporting and advancing SystemC as an industry-standard language for electronic system-level (ESL) design.

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DATE 2010 Conference

The DATE 2010 conference will take place at the ICC in Dresden, Germany from 8-12 March 2010. DATE 2010 offers a technical programme of 77 technical sessions including 12 special sessions such as panels and hot topic sessions. The programme features the most recent industrial trends and new research findings which will have a significant impact on the future of the electronics industry and academic research.

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