The 2011 Common Platform Technology Forum will take place at the Santa Clara Convention Center on January 18th. The forum will present technical details of the 28nm HKMG design for low-power applications. The event will also include technology advancements in SoC enablement solutions, materials science, process technology and manufacturing. The Common Platform alliance was formed by IBM, Samsung Electronics and GLOBALFOUNDRIES. The alliance focuses on jointly developed digital CMOS process technologies and advanced manufacturing.