Tag Archives: Chip-Package-System

Apache to Host Low Power Webinar Series

Apache Design announced four online seminars for this month. The webcasts will cover simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics. The Apache Low Power Webinar Series will take place July 24, July 25, July 26, and July 31.

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Apache Design Sponsors Two DesignCon Chip Package System Workshops

Apache Design, Inc. is sponsoring two Chip-Package-System (CPS) workshops at DesignCon 2012. The two in-depth technical workshops will provide designers with an open forum for exchanging the latest ideas and information on the most current technologies. In the interactive workshops, leading semiconductor companies and system houses will share perspectives and best practices on chip and package modeling, and system-level verification for signal integrity, power integrity, electromagnetic interference and thermal. The workshops are free. However, seating is limited and registration is required.

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Apache Design Solutions Offers Low-power Webinars

Apache Design Solutions is offering a series of low-power webinars. The webcasts will cover low power methodologies, IP integration, chip-package-system solutions, RTL power analysis, SoC power integrity, analog mixed-signal power noise, full-chip ESD integrity, and IC package power. The eight online seminars will take place at 11am (PDT) in the months of July and August.

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