Tag Archives: Carbon Design Systems

Carbon SoCDesigner Plus Features More Swap & Play Models

Carbon Design Systems recently released the latest version of SoCDesigner Plus. The new version expands the models eligible to be used with Swap & Play. SoCDesigner Plus automatically supports all fabric and DDRx memory controller components. As a result, many more design teams can boot an operating system in seconds and then debug with 100% accuracy using Swap & Play. Carbon’s newly enhanced Swap & Play support and updated CPAKs are available now for all SoCDesigner Plus users.

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Carbon Performance Analysis Kit for ARM Cortex-R7 Processor

Carbon Design Systems introduced the Carbon Performance Analysis Kit (CPAK) for the ARM Cortex-R7 processor. The Carbon Performance Analysis Kit helps architects and engineers start early performance and power analysis, and reduces the time to market and minimizes the risk of a complete redesign. The Cortex-R7 CPAK and model are available now for download from the Carbon IP Exchange web portal.

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Carbon Design Systems and Cadence Design Systems Team on Performance Analysis Kit

Carbon Design Systems and Cadence Design Systems announced the availability of a Carbon Performance Analysis Kit. The CPAK accelerates the intellectual property (IP) benchmark process. The Carbon/Cadence CPAK is available now from Carbon’s IP Exchange web portal. Ported CoreMark benchmarking software is available from coremark.org.

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Carbon Design Systems Launches Performance Analysis Kits

Carbon Performance Analysis Kits (CPAK) ~ Carbon Design Systems

Carbon Design Systems is accelerating the analysis, optimization and verification of system-on-chip (SoC) performance with their new Carbon Performance Analysis Kits (CPAK). The CPAK family for ARM Cortex processors includes reference hardware and software designs along with analysis and debug software for the Cortex-A9, Cortex-A15 and Cortex-A7 cores, and the ARM big.LITTLE subsystem. The CPAK Family for ARM Cortex A-Series Processors will be available in bare metal and Linux configurations in this quarter. Android configurations will be available in the second half of this year.

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TLM-2.0 Kit for AMBA – Modeling AMBA Protocols in SystemC TLM-2.0

Carbon Design Systems announced a TLM-2.0 solution for the AMBA protocol. The solution enables modeling the AMBA protocols with SystemC TLM2-0. The TLM-2.0 for the AMBA protocol solution will execute in any SystemC environment and contains no runtime licensing. Engineers can create models representing AMBA intellectual property (IP) blocks at any level of abstraction. The TLM-2.0 for the AMBA protocol solution is available for free from Carbon’s IP Exchange.

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Carbon Models for ARM Mali Graphic Processor Units

Carbon Design Systems unveiled virtual models for ARM Mali Graphic Processor Units (GPUs). The new Mali models represent the first in a new generation of ARM models from Carbon Design Systems. The built-in TLM-2.0 interface gives each model the flexibility for architectural exploration, firmware development and application software development. Mali models are available now from Carbon Design Systems.

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VeriSilicon ZSP Models for Carbon SoC Designer Virtual Platform

Carbon Design Systems and VeriSilicon have integrated VeriSilicon’s ZSP models into the Carbon SoC Designer virtual platform. VeriSilicon processors enable users to perform implementation-accurate architectural analysis and pre-silicon firmware development. The VeriSilicon ZSP integration is available now from Carbon Design Systems.

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Carbon Design Systems SoC Designer Supports ARM Fast Models

The SoC Designer virtual platform, from Carbon Design Systems, now features full support for Fast Models from ARM. The support will enable users to leverage a single virtual platform environment for every aspect of the development process. SoC Designer helps users to easily perform tasks ranging from application software development to low-level firmware development and even architectural design. SoC Designer with support for Fast Models is available now to select customers and will be generally available in the first quarter of 2010.

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