COOL Chips International Symposium will take place April 14-16, 2010 in Yokohama, Japan. The COOL Chips symposium covers leading-edge technologies in all areas of microprocessors and their applications. The conference is sponsored by the Technical Committees on Microprocessors and Microcomputers and Computer Architecture of the IEEE Computer Society.
Tensilica is offering a webinar on the the five pitfalls of 4G baseband SOC design. The webcast will take place on Tuesday, October 27, 2009 at 11 am PT (2 pm ET). The webinar explores five significant challenges faced by designers of efficient digital basebands, including pitfalls in LTE’s many modes, excessive cost and power, the “million MIPS” hurdle of Turbo decoding, and the dilemma of choosing the right communications among the LTE building blocks. The online seminar uses detailed examples from an end-to-end LTE PHY baseband architecture to highlight the key dos and don’ts.