Tag Archives: 3D

AWR Debuts Analyst Parallelized 3D FEM EM Simulation and Analysis Software

AWR Analyst parallelized 3D finite element method (FEM) electromagnetic (EM) simulation and analysis software

AWR launched Analyst, which is a parallelized 3D finite element method (FEM) electromagnetic (EM) simulation and analysis software. It is seamlessly and fully integrated within the AWR Design Environment. Analyst lets you move from circuit concept to full 3D EM verification with a single mouse click. With 3D EM and circuit analysis in one integrated workflow, engineers can spend their time designing and optimizing for performance.

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NI Vision Development Module 2012 Enables 3D Vision in LabVIEW

National Instruments introduced the NI Vision Development Module 2012. The LabVIEW module helps engineers develop and deploy machine vision applications. The Vision Development Module features hundreds of functions for acquiring images from a multitude of cameras and for processing images by enhancing them, checking for presence, locating features, identifying objects, and measuring parts. The cost of the NI Vision Development Module 2012 starts at $3,699 (€3,549; ¥449,000).

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Mentor Graphics Launches 1D-3D CFD Simulation Software Tool

Mentor Graphics introduced a 1D-3D general-purpose software solution that combines 1D and 3D computational fluid dynamics (CFD). The solution is based on 3D FloEFD Concurrent CFD and 1D Flowmaster, which was recently acquired by Mentor Graphics. The Mentor Graphics 1D-3D product line will be available in the second half of this year.

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Mentor Graphics Releases HyperLynx v8.2 Tool Suite

Mentor Graphics rolled out HyperLynx release 8.2. HyperLynx is a suite of analysis tools for optimizing printed circuit board (PCB) designs. New features include 3D full-wave field solving, and integrated thermal/power co-simulation analysis capabilities. Specialized 3D modeling is required for analysis of multi-GHz SERDES channel interconnects (such as PCIe-Gen 3). The Mentor HyperLynx v8.2 tool suite will ship in volume next month.

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Synopsys Rapid3D Technology for StarRC Custom 3D Extraction

Rapid3D technology is a new 3D fast field solver engine fully integrated into Synopsys’ StarRC Custom parasitic extraction solution. Rapid3D technology features attofarad accuracy and significant speedup by incorporating the latest advancements in 3D field solver algorithms. These algorithms take full advantage of modern multicore hardware to solve the accuracy and runtime challenges of sub-45-nanometer (nm) extraction for custom IC design and IP characterization.

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3D Advanced Machines Environment for Electromagnetic Design

Cobham Technical Services announced the 3D Advanced Machines Environment, which is a 3D version of their rapid electromagnetic design tool for rotating electrical machines. The new tool combines the accuracy of finite-element analysis (FEA) simulation with a design entry system that creates full 3D models of electric motors or generators within minutes. The software is an application-specific toolbox of the Opera electromagnetic simulator, and enables users to achieve radical new levels of design productivity and performance.

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COLLADA 1.4 Adopters Package

The COLLADA 1.4 Adopters Package is complete and under final review prior to public release. The Adopters Package contains both conformance testing software and documentation intended to drive rapid evaluation, deployment, and acceptance of the COLLADA specification in 3D content creation, and asset management software. The Khronos Group expects the Adopters Package to be released next month.

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Co-Design Solutions – Bridging the Gap from Silicon to System

At the Microelectronics Packaging and Test Engineering Council (MEPTEC) Technical Symposium, Apache Design Solutions will take part in a technical session, Co-Design Solutions – Bridging the Gap from Silicon to System. The session will focus on fast 3D EM simulations. MEPTEC takes place in San Jose, California, on Thursday, February 25.

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Open Source Symbian^3 Platform

The Symbian Foundation introduced the Symbian^3 (S^3) platform. S^3 is expected to be “feature complete” by the end of the first quarter and the release will include significant usability and interface advances, faster networking, acceleration for 2D and 3D graphics in games and applications, HDMI support (High-Definition Multimedia Interface), music store integration, an improved user interface with easier navigation and multi-touch gesture support, a feature-rich homescreen, and the ability to run even more applications simultaneously.

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