Tag Archives: 3D-Nano Patterns

Micro- and Nanopatterning of Inorganic and Polymeric Substrates by Indentation Lithography

The Whitesides Group at Harvard University and CSM Instruments published an nanotech article on complex 3D-nano patterns with Indentation Lithography (IndL) and piezo technology. The paper describes the use of a nanoindenter, equipped with a diamond tip, to form patterns of indentations on planar substrates (epoxy, silicon, and SiO2). The indentations have the form of pits and furrows, whose cross-sectional profiles are determined by the shapes of the diamond indenters, and whose dimensions are determined by the applied load and hardness of the substrate.

Continue reading