Gates-on-the-Fly Fixes Logic Equivalence Check Failures White Paper
SynaptiCAD recently published a white paper that describes how their updated Gates-on-the-Fly (GOF) was used to find and fix failures identified by Cadence’s Conformal tool. SynaptiCAD’s Verilog netlist editor was updated to support easy correction of logic equivalence failures introduced during modifications to post-synthesis netlists, using equivalence check reports from either Cadence’s Conformal LEC or [...]
Semiconductor Sales Increased by 37% in July 2010
According to the Semiconductor Industry Association (SIA), global semiconductors sales grew to $25.2 billion in July. This is a 1.2% increase from June when sales were $24.9 billion and an increase of 37% from July 2009 when sales were $18.4 billion. Year to date sales total increased 46.7% to $169.2 billion from the $115.3 billion [...]
White Paper: Tilted Elliptical Dirac Cones at a Half-metal Surface
The Department of Chemistry at the University of Cambridge recently published a paper in Physical Review B. The article is titled, Tilted Elliptical Dirac Cones at a Half-metal Surface. The paper, written by Dr. Stephen Jenkins, highlights the novel electronic properties of an alloy. The half-metallic alloy NiMnSb exhibits properties previously only observed in graphene [...]
Integrating Bluetooth Capability into Your Design White Paper
Jungo published a new white paper this week. It’s titled, “Integrating Bluetooth Capability into Your Design.” The technical paper examines the increasingly ubiquitous role of bluetooth in short-range wireless data transfer and describes how the complexity of the protocol could pose a significant learning and development curve for device manufacturers.
White Paper ~ End-To-End System Design: Advantages of an Integrated Tool
AWR Corporation published a new system planning white paper. The AWR white paper outlines the benefits of using a commercial, specialized software program such as Visual System Simulator (VSS) for end-to-end system design, while also embracing legacy approaches with the incorporation of spreadsheet views. The technical paper is available now for AWR.
SEMATECH, Zeiss Develop PROVE Registration, Overlay Metrology System
Carl Zeiss Semiconductor Metrology Systems (SMS) division’s registration and overlay metrology system has successfully passed a key development milestone. The system, called PROVE, was developed by both SEMATECH and Carl Zeiss. The two companies demonstrated the measurement capability for advanced photomasks for the 32 nm node and below. In a series of test runs, 0.5 [...]
Thermoelectric Assemblies and Modules for Telecommunication Applications
Laird Technologies published another application note titled Thermoelectric Assemblies and Modules for Telecommunication Applications. The application note explains why Thermoelectric Modules (TEMs) and Thermoelectric Assemblies (TEAs) are ideal thermal management solutions for many telecommunication applications such as laser diodes and laser pump diodes, cable television (CATV) laser diodes, avalanche photodiodes (ADPs), GPS backup cellular networks, [...]
Development of Highly Reliable Multilayer Piezo Actuators White Paper
PI (Physik Instrumente) published a white paper on the development and test of highly reliable multilayer piezo actuators. The white paper describes the development and lifetime tests of ceramic encapsulated actuators under different operating conditions (DC and AC). The actuators are compared to polymer coated piezo ceramic actuators in long term tests. Equations and graphs [...]
Imec Develops Narrow Pitch Interconnects
Imec created the first electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach. According to imec, this is a major step towards 20nm half pitch interconnects. Spacer-defined (or self-aligned) double patterning has recently gained interest as the patterning technique for future FLASH memory devices. Memory vendors will benefit from this [...]
Thermoelectric Modules for Charge-Coupled Devices
Laird Technologies published an application note titled Thermoelectric Modules for Charge-Coupled Devices. The application note describes the reason Thermoelectric Modules (TEMs) are the only effective thermal management solution for Charge-Coupled Devices (CCDs) used in astronomy, night vision, high-speed, medical, and quality control camera applications. The application note is the newest in a series describing the [...]
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