AWR published a new application note about the synthesis and design of complex filters. The app note uses a hairpin bandpass filter to illustrate how AWR’s iFilter synthesis software in conjunction with Microwave Office high-frequency design software and AXIEM 3D planar electromagnetic (EM) solver can help designers create filters that conform to specific manufacturing constraints and costs. The title of the paper is Synthesizing and Optimizing a Hairpin Bandpass Filter with AWR Tools.
PI (Physik Instrumente) published an interesting technote about using scanning probe microscopy with piezo stages and capacitive nanometrology sensors to improve nano-indentation and materials testing systems. The NanoTest from Micro Materials is ideal for use with a wide range of materials because it can apply forces of between 30 nN and 500 mN depending on the operating mode, and it can measure penetration depths of between 0.1 nm and 50 ìm. The task is carried out by a high-resolution capacitive sensor, the PISeca sensor from PI.
The Whitesides Group at Harvard University and CSM Instruments published an nanotech article on complex 3D-nano patterns with Indentation Lithography (IndL) and piezo technology. The paper describes the use of a nanoindenter, equipped with a diamond tip, to form patterns of indentations on planar substrates (epoxy, silicon, and SiO2). The indentations have the form of pits and furrows, whose cross-sectional profiles are determined by the shapes of the diamond indenters, and whose dimensions are determined by the applied load and hardness of the substrate.
Imec is creating a new industrial research program on high-bandwidth optical input/output (I/O). The goal of the new program is to explore the use of optical solutions for realizing high-bandwidth I/O between CMOS chips. The affiliation program is a part of imec’s research platform on deep-submicron CMOS scaling. In close collaboration with imec’s industrial partners, the optical I/O program will develop a silicon-photonics solution for addressing the upcoming scaling challenges in interconnecting CMOS chips.
VDC Research Group (VDC) revealed their 2011 predictions for the key trends anticipated to shape the embedded software and tools industry. VDC will continue it’s coverage on the embedded software and systems market in 2011 with their Embedded Software & Tools Market Intelligence Service 2011. VDC analysts will also provide a more detailed examination of their thoughts on 2011 during the webcast Tracking the Solutions Powering the Next Generation of Embedded Systems in Q4 & Beyond.
Imec recently revealed their CMOS research in scaling logic, DRAM and non-volatile memory. A new device based on non-silicon channels was realized to scale high-performance logic towards the sub-20nm node. In addition, imec developed low-leakage capacitors enabling DRAM to be pushed to the 2x nm node. Imec also shared their research on the switching mechanism of resistive RAM for next-generation flash memories (RRAM). The results were obtained in cooperation with imec’s key partners in its core CMOS programs: Intel, Micron, Panasonic, Samsung, TSMC, Sony, Fujitsu, Infineon, Qualcomm, ST Microelectronic and Amkor.
Open Core Protocol International Partnership (OCP-IP) published a white paper titled “A Memory Subsystem Model for Evaluating Network-on-Chip Performance.” The technical paper discusses performance characteristics of DRAM memories that affect NoC evaluation. Work on the white paper was completed by the OCP-IP Network on Chip Benchmarking Working Group led by Tampere University of Technology and Sonics Inc.
VTI Vacuum Technologies recently partnered with William D. Kimmel, PE (principal in the engineering consulting firm of Kimmel Gerke Associates) on a white paper that was written to educate people in related industries who aren’t familiar with how shielding works. The technical paper, EMC Shielding Simplified, explains the fundamentals of the EMC shielding process. The whitepaper discusses basic physics and concepts to ensure shielding effectiveness, as well as the shielding materials used. In addition, the artile details how to make shielding work properly, some typical shielding failures and how to solve those failures.
According to International Data Corporation (IDC), worldwide PC microprocessor unit shipments and revenues in the third calendar quarter of 2010 (3Q10) increased 2.1% and 2.5%, respectively, compared to 2Q10. Worldwide PC microprocessor unit shipments and revenues in the third calendar quarter of 2010 (3Q10) increased 8.6% and 24.1%, respectively, compared to the third quarter of 2009. The findings were published in IDC’s latest PC processor study, Worldwide PC Microprocessor 3Q10 Vendor Shares.
Cadence Design Systems recently published a white paper on their new Silicon Realization approach. The technical paper explains how Silicon Realization is a fundamentally new approach to semiconductor design, verification, and implementation. Silicon Realization extends traditional EDA to cover both integration and creation. It unites functional, physical, and electrical concerns. It is also based on three emerging concepts: unified intent, higher abstraction levels, and convergence.