2011 Predictions for the Embedded Software and Tools Market
VDC Research Group (VDC) revealed their 2011 predictions for the key trends anticipated to shape the embedded software and tools industry. VDC will continue it’s coverage on the embedded software and systems market in 2011 with their Embedded Software & Tools Market Intelligence Service 2011. VDC analysts will also provide a more detailed examination of [...]
Imec Research on Implant-free SiGe, 2x nm Node DRAM, and RRAM
Imec recently revealed their CMOS research in scaling logic, DRAM and non-volatile memory. A new device based on non-silicon channels was realized to scale high-performance logic towards the sub-20nm node. In addition, imec developed low-leakage capacitors enabling DRAM to be pushed to the 2x nm node. Imec also shared their research on the switching mechanism [...]
White Paper: Memory Subsystem Model for Evaluating Network-on-Chip Performance
Open Core Protocol International Partnership (OCP-IP) published a white paper titled “A Memory Subsystem Model for Evaluating Network-on-Chip Performance.” The technical paper discusses performance characteristics of DRAM memories that affect NoC evaluation. Work on the white paper was completed by the OCP-IP Network on Chip Benchmarking Working Group led by Tampere University of Technology and [...]
EMC Shielding Simplified White Paper
VTI Vacuum Technologies recently partnered with William D. Kimmel, PE (principal in the engineering consulting firm of Kimmel Gerke Associates) on a white paper that was written to educate people in related industries who aren’t familiar with how shielding works. The technical paper, EMC Shielding Simplified, explains the fundamentals of the EMC shielding process. The [...]
IDC Worldwide PC Microprocessor 3Q10 Stats
According to International Data Corporation (IDC), worldwide PC microprocessor unit shipments and revenues in the third calendar quarter of 2010 (3Q10) increased 2.1% and 2.5%, respectively, compared to 2Q10. Worldwide PC microprocessor unit shipments and revenues in the third calendar quarter of 2010 (3Q10) increased 8.6% and 24.1%, respectively, compared to the third quarter of [...]
White Paper: Cadence Design Systems Silicon Realization
Cadence Design Systems recently published a white paper on their new Silicon Realization approach. The technical paper explains how Silicon Realization is a fundamentally new approach to semiconductor design, verification, and implementation. Silicon Realization extends traditional EDA to cover both integration and creation. It unites functional, physical, and electrical concerns. It is also based on [...]
White Paper: Advantages of Multi-rate Harmonic Balance Technology
AWR recently published a new white paper, The Advantages of Multi-rate Harmonic Balance Technology. To make harmonic balance analysis viable, AWR has pioneered a multi-rate harmonic balance (MRHB) technology within its APLAC family of harmonic balance and time-domain simulators. The capabilities provided with MRHB make it possible to solve entire complex subsystems such as mobile [...]
White Paper: World’s Smallest OSGi Solution
ProSyst recently ported their OSGi solution (ProSyst mBS) to an embedded low power hardware with an ARM9 CPU at 156 MHz and 8 MB RAM and flash memory. ProSyst mBS, is fully compliant and certified for OSGi revision 4.2. The OSGi framework provides sufficient resources for applications and services. It meets all non-functional requirements of [...]
VDC Research Embedded and Enterprise Lifecycle Management Webinar
VDC Research Group is offering a webinar titled, Requirements Convergence: Embedded and Enterprise Lifecycle Management. The webcast will take place September 29, 2010 at 1:00 pm EST. During the online seminar, Chris Rommel (Senior Analyst for the Embedded Software and Tools) will discuss high-level findings from VDC’s research into the Software and System Lifecycle Management [...]
COM Express for Harsh Environments White Paper
GE Intelligent Platforms recently published a white paper titled, COM Express for Harsh Environments. The white paper describes how design innovation of COM technology can expand its reach beyond low-stress environments and into more rugged conditions. The GE COM Express white paper discusses key considerations in selecting a COM Express module specifically designed for harsh [...]
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