Agilent, Stanford University Research Nanoscale Devices
Agilent Technologies and Stanford University are working on a research program designed to explore a new class of nanoscale devices using a combinations of the scanning probe microscope (SPM) and atomic layer deposition (ALD). The research will enable the rapid prototyping and characterization of nanoscale devices with breakthroughs in sub 10 nm scale for a [...]
Terepac and IMEC Team on Flexible Electronics Packaging
Terepac teamed with IMEC to develop packaging technologies for flexible electronics. The initial driver for the synergistic shared research relationship is a next generation wireless ECG system, developed in the Human++ Program at Holst Centre, Eindhoven. The patented photochemical printing process, thinned silicon dies, and passive components can be placed on flexible substrates at speeds [...]
IMEC-TSMC Innovation Incubation Alliance
IMEC and TSMC is forming an Innovation Incubation Alliance to create a platform for enabling the development of product solutions using emerging More-than-Moore technology options. Integrating extra functionalities with foundry CMOS enables customers to compete in emerging markets. By combining IMEC’s expertise in design and technology R&D with TSMC’s excellence in high-volume manufacturing, customers will [...]
Integrated Solutions for Technology Exploration Industrial Affiliation Program
IMEC announced the Integrated Solutions for Technology Exploration (INSITE) industrial affiliation program (IIAP). INSITE is a framework of design exploration modules that enables fables and fablite companies, foundries, and EDA vendors to develop design and product information using emerging IC process technologies one to three generations ahead of IC manufacturing. INSITE can be used to [...]
IMEC 8-channel Wireless EEG System for Ambulatory Monitoring
IMEC and the Holst Centre announced a miniaturized and wireless 8-channel EEG system. The system is powered by IMEC’s 8-channel ultra low-power analog readout ASIC (application-specific integrated circuit). The electronics, including ASIC, radio, and controller chips are integrated on a printed-circuit board that measures only 47mm by 27mm. The whole system is packaged in a [...]
Electronic Design Automation Second Quarter 2009 Revenue
According to the EDA Consortium (EDAC) Market Statistics Service (MSS), the Electronic Design Automation (EDA) industry revenue for Q2 2009 is $1,125.5 million (5.6% sequential decline from Q1). On a Q2/Q2 basis, EDA industry revenue declined 15.8% to $1,125.5 million, compared to $1,335.9 million in Q2 2008. The four-quarter moving average declined 13.9%. Companies that [...]
Etna 3D Chip with Integrated Commercial DRAM Chip on Top of Logic IC
IMEC and their 3D integration partners (including memory suppliers and IC manufacturers) have taped-out Etna, which is a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as close as possible to future commercial chips. It consists of a 25µm thick logic die on top [...]
Thermoelectrics vs Compressors in Climate Controlled Electronic Enclosures
Laird Technologies published an application note entitled “Thermoelectrics vs. Compressors in Climate-Controlled Electronic Enclosures.” The application note compares and contrasts the two cooling technologies in order to provide the best solution for a climate-controlled enclosure application. Comparisons of efficiency, reliability, control accuracy, as well as installation and maintenance, demonstrate that a thermoelectric solution has significant [...]
Advanced Materials and Design for Electromagnetic Interference Shielding
Laird Technologies announced the publication of “Advanced Materials and Design for Electromagnetic Interference Shielding” by Dr. Xingcun Colin Tong, PhD (EMI Materials Engineer). The book focuses on the role that EMI shielding plays in EMC (Electromagnetic Compliance) design and reviews EMI shielding with emphasis on materials and designs across many industry applications. Features of the [...]
IMEC Electrocardiogram Necklace
IMEC and the Holst Centre presented a prototype of an electrocardiogram or ECG necklace at the IEEE Engineering in Medicine & Biology Conference (EMBC) in Minneapolis, Minnesota (USA). The technology enables long-term monitoring of cardiac performance and enables patients to remain ambulatory and continue their routine daily activities while under observation. The embedded beat detection [...]
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