Category Archives: News

EDA industry news

EDA News – 2008.05.22 Late Edition

e-Shuttle Offers Electron-Beam Direct Write Technology for 65nm ICs
e-Shuttle, Inc. is now delivering 65nm CMOS logic ICs manufactured using Electron-Beam Direct Write (EBDW) technology, the first full-scale application of EBDW techniques for complex logic ICs.

Design Automation Conference Features DACTube
The 45th Design Automation Conference (DAC) Web site includes a new, interactive feature this year. DAC attendees can preview speaker topics and pose questions to panelists via the popular video site YouTube and link them to the “DACTube” section of the DAC Web site.

Tektronix Develops First Methods of Implementation for UWB WiMedia 1.2
Tektronix, Inc. announced it had created the world’s first Methods of Implementation (MOI) for the new Ultra-Wideband (UWB) WiMedia PHY Test Specification Version 1.2 and released a new version of UWB Analysis software for DSA/DPO70000 series oscilloscopes that provides additional measurements for UWB WiMedia 1.2.

VIA Technologies Rolls Out EPIA M700 Mini-ITX Board
VIA Technologies, Inc announced the VIA EPIA M700 Mini-ITX board, the first to feature the VIA VX800 chipset, for sophisticated digital signage and retail display systems. The VIA EPIA M700 addresses the increasing demands for enhanced media playback and visual clarity across multiple displays in digital multimedia.

TRW Automotive Creates Scalable Airbag Electronic Control Units
The TRW Automotive Holdings Corp. (NYSE: TRW) subsidiary, TRW Automotive U.S. LLC, has developed a scalable airbag control unit (ACU) designed for the growing low-cost vehicle markets. The intelligent solution allows the ACU to be adapted within a platform to offer two options – standard and enhanced.

ASOCS Launches MP100 Wireless MultiComm Processor
ASOCS announced the launch of the MP100, the world’s first wireless MultiComms processor capable of running up to three wireless air interfaces concurrently. Customers using ASOCS’ single-chip MultiComm processor can reduce the bill of materials (BOM) by up to 50% and reduce power consumption by as much as 70%.

OKI Creates ML673520A Automotive Audio System LSI
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has developed the “ML673520A” system LSI for automotive systems. The chip increases speed of compressing and recording digital audios by ten-fold and includes a function to playback three tunes simultaneously.

Willcom Selects Wavesat Odyssey 8500 4G Chipset for XG-PHS Broadband
Willcom and Wavesat announced a special arrangement to cooperate on XG-PHS technology with the goal to accelerate the development, adoption and deployment of XG-PHS based Broadband Wireless solutions in Japan.

EDA News – 2008.05.22

Tibion, Stanford University Team on Bionics
Tibion Corporation announced that it has engaged in a collaboration with Stanford University’s Biomechanical Engineering Group to develop future applications of its bionic technology. A team of Stanford graduate students will be working to extend Tibion’s technology platform to additional medical applications.

Springer Handbook of Robotics Debuts at ICRA
Robots! Robots on Mars and in oceans, in hospitals and homes, in factories and schools, robots fighting fires, making goods and products, saving time and lives. Robots today are making a considerable impact on many aspects of modern life, from industrial manufacturing to healthcare.

Denali Selects Bluespec Synthesis for Memory Controller IP Development
Bluespec, Inc. announced that Denali Software, Inc., selected Bluespec’s high-level synthesis toolset as part of its next-generation technology platform for future memory controller IP development. Denali Software chose Bluespec’s toolset because of the productivity improvements it offers.

VirtualLogix Conforms to Open Mobile Terminal Platform Security
VirtualLogix[tm], Inc. announced its continued commitment to the Open Mobile Terminal Platform (OMTP) by submitting a Product Profile Statement in conformance with the organization’s new mobile hardware security recommendations designed to help protect against threats such as malware and fraud attacks.

Analog Devices Debuts Four-Channel ADuM540x iCoupler Digital Isolator
Analog Devices, Inc. (ADI) is expanding its extensive family of digital isolation products with a series of four-channel devices that isolate both data and power. Each device integrates ADI’s iCoupler digital isolation technology and ADI’s proprietary isoPower[tm] dc-to-dc converter.

Laird Technologies Introduces 802.11 Wireless LAN Processor Modules
Laird Technologies, Inc. announced a new range of 802.11 wireless LAN processor modules that provide a wide range of AT commands and web configuration to make the Wi-Fi transition simple for M2M (machine-to-machine) designers.

ADI Develops First Digital Isolators Qualified for Automotive Systems
Tuning its proprietary iCoupler® digital isolation technology to meet the reliability and quality needs of emerging electric-hybrid vehicles, Analog Devices, Inc. (ADI) is introducing a family of digital isolators designed to operate in today’s electrically challenging automotive environment.

EDA News – 2008.05.21 Late Edition

Calypto to Give Away PowerPro-filer Power Profiling Software at DAC
Calypto[tm] Design Systems Inc. will offer qualified Design Automation Conference (DAC) attendees who visit the Calypto Booth (#1354) a free copy of PowerPro-filer on a one gigabyte memory stick. The recently introduced PowerPro-filer is a Linux program that reads synthesizable Verilog code.

MSIM Spice Circuit Simulator Runs 10X Faster for Characterizing CCS Model
Legend Design Technology, Inc. announced that its MSIM, a high-accuracy Spice circuit simulator, has been upgraded for efficient characterization of CCS (Composite Current Source) model used in cell library characterization in SoC designs.

IEEE Working Group Updates 1647-2008 e Language Standard
The IEEE has approved a revision to IEEE 1647, Standard for the Functional Verification Language e. The e language was first ratified as a standard in 2006 and has historically been a powerful high-level verification language for hardware designers.

Technical Working Group Releases DDR PHY Interface Specification 2.0
Denali Software, Inc., as one of the DDR PHY Interface (DFI) specification participating members including ARM, Denali, Intel, and Samsung, announced the release of the new DFI specification version 2.0. The collaborative technical working group, which includes representatives from these companies, delivered several improvements and enhancements in this latest version of the DFI specification.

DAC 2008 Features Si2 Low Power Coalition Workshop
The Silicon Integration Initiative (Si2) announced the Low Power Coalition workshop being hosted at the Design Automation Conference (DAC) show to be held at the Anaheim Convention Center in Anaheim, CA, from June 8-13, 2008.

Six Events to Collocate with Design Automation Conference
The 45th Design Automation Conference (DAC) has coordinated with organizers of six related industry events and conferences to collocate with DAC to provide greater benefit to participants.

Advantest Rolls Out T5503 Memory Test Solution
Advantest Corporation (TSE: 6857, NYSE: ATE) announced its new T5503 high-throughput memory test system, boasting the industry’s highest parallel test capability of up to 128 devices. The T5503 was developed to address the challenges of high-volume production test of next-generation high-speed DDR3-SDRAM memory.

Express Logic Becomes Member of Eclipse Foundation
Express Logic, Inc. announced that it has joined the Eclipse Foundation, an open-source community, whose projects are focused on building an open development platform comprised of extensible frameworks, tools and runtimes for building, deploying and managing software across the lifecycle.

ADLINK Unveils ETX-NR667 Module with 64-bit Intel Core2 Duo Processor
ADLINK Technology Inc. (TAIEX: 6166) announced a new member to its ETX® family of Computers on Modules in production. The ETX-NR667 is based on the latest ETX® 3.02 form factor standard that allows two additional SATA ports to the module.

Arrow Couples Custom Chip Design with ARM Processors, IP
The North American Components business of Arrow Electronics, Inc. (NYSE:ARW) announced an extended relationship with ARM to broaden Arrow’s silicon offering by coupling its custom chip design and logistics capabilities with ARM® industry-standard processors and associated intellectual property.

ACCES I/O Products Rolls Out Model USB-IDIO-16 USB/104 I/O Modules
ACCES I/O Products announces the latest addition to its impressive line of USB/104 I/O modules – Model USB-IDIO-16. The unit features 16 individually optically isolated inputs and 16 fully protected solid state FET outputs capable of switching up to 2A each.

EDA News – 2008.05.21

Qualcomm Invests in ip.access
ip.access announced that Qualcomm Incorporated has made a strategic investment in the company as part of Qualcomm’s European investment fund. Terms of the investment were not disclosed. Qualcomm joins existing investors to provide funding support for ip.access’ breakthrough Oyster 3G’ femtocell system.

Low-Power Intel IVI Reference Design Features Xilinx Automotive FPGA
Xilinx, Inc. (Nasdaq: XLNX) announced availability of an integrated Xilinx Automotive (XA) field programmable gate array (FPGA) and intellectual property (IP) solution that is included in the Low-Power Intel In-Vehicle Infotainment Reference Design (Low-Power Intel IVI Reference Design) targeting automotive head units.

SafeNet Optimizes Femtocell Security Solutions to Secure Networks
SafeNet, Inc. announced that the company’s industry-proven QuickSec/IPSec Security Toolkit and family of SafeXcel IP Packet Engines for ASIC and FPGA implementations have been optimized for fast, easy, and affordable integration of security features into home base stations and the next-generation chips.

Xilinx Sponsors TD-SCDMA Evolution and LTE Summit, Shanghai 2008
Xilinx, Inc. (Nasdaq: XLNX) announced plans for the TD-SCDMA Evolution and LTE Summit, Shanghai 2008. A Diamond Sponsor for the event, Xilinx will deliver an executive keynote, host a half-day workshop, and demonstrate leading edge programmable solutions for wireless applications.

Ethernet Direct to Showcase Industrial Networking Solutions at Computex
Ethernet Direct Corporation is pleased to announce its participation at the Computex 2008 Exhibition to be held in Taipei, Taiwan from June 3rd to June 7th, 2008. Computex is held annually.

Xyalis Launches GTmask Integrated Mask Data Preparation Suite
Xyalis announced GTmask, a fully integrated environment dedicated to complex wafer masks building. GTmask offers new capabilities fully meeting mask teams’ demands, covering wafer assembly and floorplanning for chip arrays, multi-project wafers and multi-layer reticles.

Magma Announces Hydra Automated Floorplan Synthesis Product
Magma(r) Design Automation Inc. (Nasdaq:LAVA) announced Hydra(tm), an automated floorplan synthesis and hierarchical design planning product with physical optimization capabilities that delivers superior predictability.

Opera Software Rolls Out Opera Widgets SDK Beta
Opera Software released the Opera Widgets SDK beta, enabling Web developers to deploy Web applications on any device. The Opera Widgets SDK is based on open, W3C-set standards to employ common web technologies such as HTML, CSS and media queries, JavaScript and Ajax, in creating advanced Web applications.

IPextreme Licenses ColdFire Architecture to IP Square
IPextreme®, Inc. and IP Square announced that IP Square has licensed the ColdFire® Architecture for use across their product line. IP Square performed extensive research on available commercial offerings and ultimately chose the V1 ColdFire. Publishes Smart Fabric Components Report Publications announces the availability of a new report entitled “Wearable Electronics Systems Global Market Demand Analysis: Infotainment Solutions.” As the market for wearable infotainment systems is nascent, there is little defined structure to the industry.

Design Automation Conference Features 14 Workshops
Attendees to the 45th Design Automation Conference (DAC) will be able to participate in 14 workshops at this year’s conference. The workshops cover a wide variety of design technology areas as well as business-related topics. The 45th DAC will be held June 9 – 13 at the Anaheim Convention Center in Anaheim, Calif.

EDA News – 2008.05.20 Late Edition

Apache Unveils Sentinel-PI Chip Package System Co-Design, Co-Analysis
Apache Design Solutions announced Sentinel-PI, the industry’s first fully-integrated chip-package-system co-design and co-analysis solution for power integrity. Sentinel-PI provides SoC-aware modeling and analysis of the system-level power delivery network.

MIPS Hi-Fi Audio Codec IP Achieves Lowest Power Consumption
MIPS Technologies, Inc. (NasdaqGS: MIPS) announced that its Hi-Fi Audio Codec IP platform has achieved the lowest known power consumption for Hi-Fi audio playback, while reaching superior performance of 100dB dynamic range. The new CI7824sm Audio Codec sets a new standard for Hi-Fi performance at ultra low-power.

Advanced Thermal Solutions to Present Temperature Measurement Webinar
Advanced Thermal Solutions, Inc’s popular Thermal Management Webinar Series continues in May with an hour-long technical webinar, “Temperature Measurement in Electronics Design”, on Wednesday, May 28, 2008 from 2:00-3:00 p.m.

SemiSouth Laboratories to Present Normally-off SiC VJFET Paper at ISPSD
SemiSouth Laboratories Inc. will discuss the characteristics and specifications of their normally-off SiC JFET for 800V and 1200V power switching applications. SiC-based power semiconductors provide several advantages over their silicon-based counterparts.

PureDepth to Present Multi-Layer Display Paper at SID 2008
PureDepth, Inc. (OTC: PDEP) announced that Gareth Bell, Chief Scientist, will be presenting at the Society for Information Display (SID) Symposium on May 21, 2008 at 10 a.m. PDT. PureDepth’s MLD technology lends itself to a broad array of applications.

Design Automation Conference Features ACM Turing Award Winners
The 2007 ACM Turing Award Winners, Dr. Edmund M. Clarke of Carnegie Mellon University; Dr. E. Allen Emerson of the University of Texas, Austin and Dr. Joseph Sifakis of Verimag Labs, France will be guest speakers at the 45th Design Automation Conference (DAC).

ZMD to Showcase ADCs, Signal Conditioning Devices at Sensors Expo
ZMD AG will showcase analog-to-digital converters and signal conditioning devices at the Sensors Expo ( on June 9 – 11. ZMD’s booth number is 820 at the Rosemont, Illinois, event. Attendees can evaluate the devices for automotive, consumer, industrial and mobile medical applications.

VDC Releases Latest Merchant ATCA CPU Blade Shipment Forecast
VDC has released the 2008 edition of its research on Slot Single Board Computers in Volume 1 of VDC’s Merchant Computer Boards for Embedded/Real-Time Applications Intelligence Program, 2008. The actual 2007 dollar volume shipments of ATCA CPU blades exceeded VDC’s previous forecast for 2007.

OKI Releases Fingerprint Authentication LSI SDK v2 for ML67Q5250
Oki Electric Industry Co., Ltd. (TOKYO:6703) announced it has released its second version Software Development Kit (SDK) for ML67Q5250, the fingerprint authentication LSI that enables match-on-device. OKI made improvements to the SDK to enable compatibility with different types of touch sensors.

Kineto Wireless, Agilent Team on 3G, 2G UMA/GAN Handset Testing
Kineto Wireless and Agilent Technologies Inc. (NYSE: A) announced the companies are collaborating on 3G and 2G UMA/GAN handset testing to bring a comprehensive solution to their customers. The companies will focus on expanding Agilent’s 8960 “real world” UMA/GAN test capabilities.

EDA News – 2008.05.20

DS2 Rolls Out DE21P Embedded Powerline Modem Reference Design
DS2 announced the availability of a new compact reference design, the DE21P module for embedded powerline communications applications that will help drive widespread acceptance of high quality powerline enabled connectivity for home networking and IPTV applications.

Spatial Introduces EDA 3D Analysis Suite
Spatial Corp. announced the availability of the EDA 3D Analysis Suite, which enables rapid development of 3D analysis and visualization features within current EDA physical design flows. The software component suite provides unique productivity and time-to-market (TTM) advances to tool developers.

National Instruments Unveils NI ELVIS II Prototyping Platform
National Instruments (Nasdaq: NATI) announced NI ELVIS II, the latest version of the design and prototyping platform that educators worldwide have adopted for hands-on, project-based learning. NI ELVIS II gives educators 12 new USB plug-and-play instruments.

Synplicity Synplify Pro, Premier Support Altera Stratix IV FPGAs
Synopsys, Inc. (NASDAQ: SNPS) announced that the FPGA synthesis solutions from its Synplicity® Business Group, Synplify Pro® and Synplify Premier, support Altera Corporation’s 40-nanometer (nm) Stratix® IV Field Programmable Gate Arrays (FPGAs).

EVE to Feature Transactor at Design Automation Conference
EVE will showcase an expanded library of standard transactors and a new custom transactor development tool during the 45th Design Automation Conference (DAC) in booth #301 June 9-12 at the Anaheim Convention Center in Anaheim, Calif.

Toshiba Selects Calibre DFM Platform for Device Extraction Flow
Mentor Graphics Corporation (Nasdaq: MENT) announced that Toshiba Corporation has selected the Calibre® DFM Platform for its Device Extraction Flow aimed at controlling manufacturing variability at 45 nanometers (nm) and beyond.

WiMAX World EMEA 2008 Taking Place in Munich
Trendsmedia announced that industry-leading vendors will be showcasing breakthrough WiMAX products, services and technologies at the 2008 WiMAX World EMEA Conference & Expo taking place May 19 to 21 at the ICM, in Munich.

RapidIO Trade Association Gains Seven New Members
The RapidIO® Trade Association announced several milestones underscoring its position as the preferred choice of embedded designers, including members, its latest technology roadmap, and a new Marketing Working Group Chair.

Tower Semiconductor Acquires Jazz Technologies
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM) and Jazz Technologies, Inc. (AMEX: JAZ) announced the signing of a definitive agreement by which Tower will acquire all of the outstanding shares of Jazz in a stock-for-stock transaction valuing Jazz at a fully diluted equity value of approximately $40 million.

Wind River Debuts Commercial Linux Platform for In-vehicle Infotainment
Wind River Systems, Inc. (NASDAQ:WIND) announced an infotainment platform based on an automotive-optimized commercial Linux that will significantly accelerate time-to-market of innovative applications for the in-vehicle infotainment segment of the automotive industry.

Renesas Develops 32-bit RX600 Series CISC Microcontrollers
Renesas Technology Corp. announced the development of the RX600 Series microcontrollers (MCUs), re-defining performance capabilities of CISC (Complex Instruction Set Computer) based MCUs. The new devices is scheduled for sample shipment in the second quarter of 2009.

Wind River, Intel Team on Open Source Platform for Automotive Industry
Wind River Systems, Inc. (NASDAQ:WIND) announced it is collaborating with Intel Corporation to create an open source Linux platform for the automotive industry. Wind River, working with Intel, is developing an open source platform for the in-vehicle infotainment market.

Freescale Announces Multicore MSC8112, MSC8113 StarCore DSPs
Developers and designers of unified communications systems can leverage the computing power and flexibility of two advanced Freescale DSP devices based on high-performance StarCore® technology.

LDRA Tool Suite Meets CERT C Secure Coding Standard
LDRA has enhanced the capabilities of the LDRA tool suite to assist in identifying security vulnerabilities and enforce security standards for development and deployment.

EDA News – 2008.05.19 Late Edition

DFMSim Debuts Virtual Factory Tool Suite for Semiconductor Manufacturers
DFMSim launched an innovative class of software tools that enable designers and manufacturers of complex integrated circuits (ICs) to accurately predict and avoid systemic errors that seriously impact manufacturing yields and harm their bottom lines.

802.11n WLAN DOCSIS 3.0 Gateway Reference Design with TI Puma 5
Ralink announced that its Wi-Fi 802.11n solution – RT2880 iNIC now supports Texas Instruments’ Puma 5 family of DOCSIS® 3.0-based (Data Over Cable Service Interface Specification) cable modem chipsets. TI’s Puma 5 family is a DOCSIS 3.0 compliant cable modem chipset.

Sequence Design Speeds RTL Power Reduction with PowerArtist
Sequence Design introduced PowerArtist[tm], offering the industry’s fastest automated RTL power reduction – 10 to 50 percent or more depending on the design – in just minutes on a million-plus gate block.

Cypress, UICO to Create Electronic UI for Appliance, Medical, Industrial
Cypress Semiconductor Corp. (Cypress) (NYSE:CY) announced a joint marketing agreement with UICO, LLC (UICO) enabling UICO to deliver innovative electronic user-interface (UI) solutions to the appliance, medical, and industrial markets.

Sicap, Red Bend to Provide Seamless Management of Mobile Devices
Mobile operators and device manufacturers will now have complete control over remotely managing all mobile devices in the network using a standards-based, fully interoperable solution from Sicap and Red Bend Software.

NEC Develops Technology for Complex, Non Rectangular TFT LCD Modules
NEC LCD Technologies announced the successful development of a manufacturing technology that enables more flexible design of thin-film transistor (TFT) liquid crystal display (LCD) panels. The prototype design is a heart-shaped low-temperature polysilicon (LTPS) color TFT LCD module.

Texas Instruments Rolls Out TNETC4820 Puma 5 DOCSIS 3.0 Chipset
Texas Instruments Incorporated (TI) [NYSE: TXN] announced a new DOCSIS 3.0® (Data Over Cable Service Interface Specification) product that supports cable set-top-boxes (STB) with both MPEG-TS (transport stream) and Internet Protocol (IP) capabilities.

International Rectifier Unveils MOSFETs for Power Supplies, Electric Motors
International Rectifier, IR® (NYSE: IRF) introduced a new family of 60 V and 75 V MOSFETs optimized for industrial battery applications such as E-bikes, scooters and utility carts. The new N-channel devices utilize IR’s trench MOSFET technology.

Jennic Creates LoWPAN Networking Stack for Embedded IP Communications
Jennic announces the industry’s first networking stack to enable a single-chip implementation for next-generation low-power wireless IP in embedded devices. Applications may leverage existing IP infrastructure and knowledge base, reducing development costs and time to market.

Texas Instruments Announces TPS65136 Organic LED Power Driver
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced an organic light emitting diode (OLED) power driver designed to enhance image quality for small form factor displays up to 2.5 inches.

Infineon DECT 6.0 / CAT-iq Chipset Features TI Puma 5 DOCSIS 3.0 Cable Modem
Infineon Technologies AG (FWB:IFX) (NYSE:IFX) announced a cost-effective DECT solution, which when combined with a DOCSIS 3.0 chipset, produces a platform for North American cable service providers to deploy next-generation Voice-over-IP (VoIP) services operating over DECT 6.0 cordless telephones.

Shanghai Welltech Automation Selects Ramtron FM25L16 Serial F-RAM
Ramtron International Corporation (Nasdaq: RMTR) announced that China’s Shanghai Welltech Automation Co., Ltd., a leading pressure transmitter and magnetic flow meter supplier, has designed Ramtron’s FM25L16 16-kilobit (Kb) serial F-RAM memory device into its 2000S safe pressure transmitters.

EDA News – 2008.05.19

Design Automation Conference Features Six Full Day of Tutorials
The Design Automation Conference (DAC) will offer six educational, full day tutorials focused on a variety of design methods. The tutorials will provide an in-depth look at some of the most difficult and fascinating areas of electronic design.

UPDM Group Forms for Unified Profile for DoDAF and MODAF
A new industry standards group, the UPDM Group, has been established to build on previous efforts within the Object Management Group (OMG) to develop a modeling standard that supports both the US Department of Defense Architecture Framework (DoDAF) and the UK’s Ministry of Defence Architecture Framework (MODAF).

Altera Announces Quartus II Software Version 8.0
Altera Corporation (NASDAQ:ALTR) announced its Quartus® II software version 8.0, supporting the company’s 40-nm Stratix® IV FPGAs and HardCopy® ASICs. This version of the Quartus II software delivers a full two-speed grade advantage and 3X faster compile times for high-end FPGAs.

Evatronix Debuts HDLC Connectivity Platform for 8051 SoC Development
Evatronix SA, announced the HDLC Connectivity Platform – an integrated solution that will significantly shorten the time necessary for development of an 8-bit SoC enhanced with advanced data communication capabilities.

Mentor Graphics Precision Synthesis Supports Altera Stratix IV FPGAs
Mentor Graphics Corporation (NASDAQ: MENT) announced that its Precision® Synthesis family of products and its leading ANSI C++ high-level synthesis product, Catapult® C Synthesis, support Altera Corporation’s 40 nanometer (nm) Stratix® IV field programmable gate arrays (FPGAs).

Sensata Develops Vision Camera System with CoFluent Studio
CoFluent Design, Inc. announced that Sensata Technologies selected CoFluent Studio[tm] for the development of its new camera system aimed at automotive and security applications.

Freescale Introduces S12P Microcontrollers with Integrated CAN
Freescale Semiconductor introduced the latest addition to its 16-bit automotive microcontroller (MCU) portfolio. The advanced S12P family is Freescale’s most recent 16-bit MCU with integrated controller area network (CAN) functionality, bridging the gap between 8-bit and 16-bit devices for the automotive market.

Altera Develops First 40nm FPGAs, HardCopy ASICs
Altera Corporation (NASDAQ:ALTR) announced the industry’s first 40-nm FPGAs and HardCopy® ASICs. The Stratix® IV FPGAs and HardCopy IV ASICs, both with transceivers options, provide unprecedented densities, performance and low-power leadership.

Freescale, Virtutech Reveal Results of Embedded Developers Survey
An informal study of more than 200 embedded developers attending last month’s Embedded Systems Conference (ESC) indicates that programmability challenges and the prospects of longer development cycles might be affecting the adoption rate of embedded multicore technology.

Sequans SQN1170 Mobile WiMAX Chip Integrates Baseband, RF, Memory
SEQUANS Communications announced availability of its newest chip, the SQN1170, which integrates baseband, RF, and memory in a single chip. Sequans also announced that Mitsumi, leading system-in-package module maker, is the first to use the chip to develop an SDIO module comprising full Mobile WiMAX system functionality.

Freescale Announces MPC563xM Powertrain MCUs with Emissions Control
Freescale Semiconductor has introduced a family of 32-bit automotive microcontrollers (MCUs) with integrated emissions control technology. These MCUs are engineered to help reduce carbon dioxide emissions and enable cost-effective, yet sophisticated engine control designs for emerging markets.

Embedded Planet Rolls Out EP8548A, EP8641A SCOPE Compliant Boards
Embedded Planet announced the availability of two invaluable SCOPE-compliant boards that are ideal for a broad range of demanding applications, including wireless base stations, media gateways, enterprise network access systems, test and measurement systems, and server blades.

EDA News – 2008.05.18

IXYS Makes Proposal to Acquire ZiLOG for $4.50 Per Share
IXYS Corporation (NASDAQ:IXYS) announced that it has made a proposal to the ZiLOG, Inc. (NASDAQ:ZILG) Board of Directors to acquire all the outstanding shares of ZiLOG common stock for per share consideration of $4.50, to be paid in cash and stock. Below is the text of the letter that IXYS sent to ZiLOG’s Board of Directors:

Berkeley Analog FastSPICE Qualifies for TSMC 40/65 Nanometer SPICE
Berkeley Design Automation Inc. announced that its Analog FastSPICE[tm] circuit simulator is qualified through TSMC’s 40/65-Nanometer SPICE Tool Qualification Program. The program improves simulation accuracy, shortens transistor-level simulation cycle time, and increases simulation capacity for high performance digital circuits and mixed-signal RF designs.

Avago Makes RF Packaging Breakthrough with WaferCap Chip Scale Technology
Avago Technologies announced a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. The company is a leading supplier of analog interface components for communications, industrial and consumer applications. Avago’s innovative WaferCap is the industry’s first semiconductor-based chip scale packaging (CSP) technology.

Sensory Unveils BlueGenie Lite Speech Output Solution for Bluetooth
Sensory, Inc. announced the availability of BlueGenie Lite[tm], a speech output solution for Bluetooth devices running on the industry’s most popular chipsets, CSR’s BlueCore 3 and BlueCore 5. This cost-effective solution tailors the software capabilities to focus on voice output only, enabling voice menu’s and prompts to improve usability and reduce user confusion for a wider range of Bluetooth headsets and hands-free car kits.

California Micro Display Controller Architecture Supports MDDI, MIPI
California Micro Devices (NASDAQ: CAMD) announced that the company has developed an innovative display controller architecture that serves both the Mobile Display Digital Interface (MDDI) and Mobile Industry Processor Interface (MIPI) standards for high speed serial display interfaces for use in today’s most advanced mobile handsets.

EDA News – 2008.05.16

ABI Research Publishes Machine-to-Machine Market Forecasts
Markets for cellular machine-to-machine (M2M) communication modules – the radio units providing wireless connectivity to a range of devices that communicate without human intervention – are expected to show strong growth in the coming years. According to new market data from ABI Research, shipments will total nearly 80 million modules in 2013.

Carbon Design Systems Announces Automatic Model Generation Webinar
Carbon Design Systems[TM] will present the popular 45-minute webinar on automatic model generation with Carbon Model Studio for the CoWare® Platform Architect design environment. Participants will learn how to automatically generate accurate models for CoWare Platform Architect from hardware description language (HDL) code, accelerate the execution of the virtual platform and concurrently debug real software with real hardware. The webinar is useful for software developers, hardware architects and firmware designers.

Infiniscale Expands to Germany, Austria, Spain, Portugal
Infiniscale SA announced the extension of its sales representation to cover Germany, Austria, Spain and Portugal. The move is part of the company’s worldwide expansion strategy, and strengthens Infiniscale’s sales presence in Europe, a key region for analog and mixed-signals markets.

GlobalEdge Expands in Europe with SDC Systems
GlobalEdge Software Ltd. announced its partnership with SDC Systems Limited. The alliance will make available to the Communication and Consumer Electronics companies in Europe, a wide range of OEM Ready Software solutions, IP Components and embedded engineering services. GlobalEdge, together with SDC Systems, will provide a significant time-to-market advantage to Original Equipment Manufacturers (OEMs) with its reliable software products and a range of highly flexible, custom-built services. Leveraging on GlobalEdge’s extensive experience in the embedded domain and SDC System’s technical and sales support, customers will be able to develop feature rich and cost effective offerings.