TSMC iRCX Electronic Design Automation Data Format
Taiwan Semiconductor Manufacturing Company announced the iRCX interoperable electronic design automation (EDA) data format for TSMC 65nm and 40nm processes. iRCX format unifies interconnect modeling data delivery, ensures data integrity and interpretation. EDA tools which support iRCX format will be able to receive accurate interconnect modeling data from the iRCX files developed and supported by [...]
SMIC 65-nanometer Low Leakage Process IP Portfolio
Semiconductor Manufacturing International Corporation (SMIC) announced a set of 65-nanometer low leakage process IPs. SMIC’s new 65nm IPs includes a set of six memory compilers, which enable the intelligent and rapid generation of memory blocks in bulk and on the fly. The compilers feature memories optimized for very high performance and also optimized for performance [...]
SMIC 65nm Standard Cell Libraries
SMIC released three preliminary versions of their 65-nanometer standard cell libraries. The libraries include a high performance Very High Speed (VHS) library, a density and performance optimized High Speed (HS) library, and a power management kit (PMK) for the High Speed (HS) library. The new 65nm standard cell libraries were designed to meet industry standards [...]
Unified Design For Manufacturing Architecture
Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) recently announced the Unified Design For Manufacturing (UDFM) architecture. UDFM targets 32nm process technology and smaller geometries and improves yields, lowers design costs, and accelerates time-to-market and time-to-volume. UDFM provides a unified, encapsulated access to TSMC foundry data and was developed in collaboration with EDA vendors [...]
Intel, Samsung, TSMC Target 450mm Wafer Manufacturing
Intel Corporation, Samsung Electronics, and TSMC are collaboration on the transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications. The companies will cooperate with the semiconductor industry to help [...]
TSMC Multi-layer Mask Service
Taiwan Semiconductor Manufacturing Company, Inc. (TSE: 2330, NYSE: TSM) is offering a multi-layer mask service (MLM) for 90nm, 80nm and 65nm advanced process technologies. MLM service is another mask service TSMC offers beyond multi-project wafer prototyping service, CyberShuttle(SM), and normal production tape-out to enable maximum customer flexibility. MLM is ideal for prototyping single or multi-chip [...]
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