Synopsys introduced 28nm design solutions that integrate manufacturing compliance and system-level prototyping with TSMC Reference Flow 12.0. The extended Reference Flow 12.0 reduces time-to-market and speeds time-to-volume using TSMC’s 28-nm process technology. The design enablement solution features virtual prototyping and high-level synthesis linked to TSMC’s advanced processes, expanded manufacturing compliance capabilities and full support of TSMC’s latest 28-nm design rules and models within Synopsys’ Galaxy Implementation Platform.
Mentor Graphics and Dongbu HiTek rolled out a series of Technology Design Kits (TDKs). The Technology Design Kits support Dongbu HiTek’s analog-intensive BCDMOS process technologies. The TDKs used with IC Station (Mentor’s Custom IC Design Flow solution) will seamlessly accelerate BCDMOS chip designs from system specifications to post-layout verifications.
Magma Design Automation, GLOBALFOUNDRIES, and Virage Logic introduced a Unified Power Format (UPF)-compliant RTL-to-GDSII reference flow. The automated, comprehensive solution streamlines the design and manufacture of ICs that use Virage Logic’s intellectual property (IP) and are manufactured in GLOBALFOUNDRIES’ 65LPe 65-nanometer (nm) low-power process technology. The reference flow is available from Magma, GLOBALFOUNDRIES and Virage Logic upon request.
X-FAB Silicon Foundries announced the XO035 0.35 micrometer process. The XO035 foundry process is optimized for Blu-ray and high-speed optical data communication applications. XO035 includes X-FAB’s blue PIN module. The integration of the PIN diode into the 0.35 micrometer CMOS environment enables the design of high-performance photo detectors. The XO035 process is available now.
AWR and United Monolithic Semiconductors (UMS) introduced enhanced process design kits (PDKs) for the UMS PH15 and PH25 advanced gallium arsenide (GaAs) foundry processes. The enhanced PDKs enable designers to take full advantage of the process capabilities of UMS within AWR’s 2009 Microwave Office design suite including its latest technologies such as iNets, AC0E, AXIEM, and ICED DRC. Engineers can also take advantage of the fact that the PDKs are now release-independent from AWR’s own software upgrade cycle. PDKs from UMS are available to active customers of the UMS foundry and AWR software.
More info: AWR
IMEC and TSMC is forming an Innovation Incubation Alliance to create a platform for enabling the development of product solutions using emerging More-than-Moore technology options. Integrating extra functionalities with foundry CMOS enables customers to compete in emerging markets. By combining IMEC’s expertise in design and technology R&D with TSMC’s excellence in high-volume manufacturing, customers will benefit from an early access to new More-than-Moore technologies and rapid transition to volume manufacturing for their next generation electronic products.
AWR and WIN Semiconductors introduced the WIN/AWR H2W PH50-00 process design kit (PDK). The PDK for the WIN PH50-00 GaAs enhancement / depletion-mode pseudomorphic high electron mobility transistor (pHEMT) and heterojunction bipolar transistor (HBT) foundry process is the latest in AWR’s series of PDKs available for monolithic microwave integrated circuit (MMIC) designers. The AWR/WIN PH50-00 PDK is available now for use within AWR’s Microwave Office v2009 software. All AWR/WIN PDKs are distributed by WIN Semiconductor and available free of charge to qualifying customers.
X-FAB Silicon Foundries introduced TheKit process design kits (PDK). TheKit is based on the Cadence Design Systems Virtuoso IC 6.1 custom design platform and SKILL programming language. TheKit is available for all of X-FAB’s process technologies from 1.0 um down to 0.18 um. The process design kit offers a smooth and easy migration from existing projects developed with Virtuoso IC 5.1 to Virtuoso IC 6.1. The automatic project setup, libraries, and default tool settings result in a seamless design flow that saves setup time.
X-FAB Silicon Foundries introduced the XA035 analog/mixed-signal complementary metal-oxide-semiconductor (CMOS) high-temperature foundry process for integrated circuits (ICs) requiring operating temperatures up to 175 degrees Celsius. The modular 0.35 micrometer process is the first to enable high-temperature-capable system-on-chip (SoC) solutions, combining high-voltage (HV) and embedded non-volatile memory (NVM) elements. The XA035 technology for high-temperature applications is available now.
Magma Design Automation unveiled a low-power Talus-based IC implementation reference flow for the 65-nanometer process and low-leakage-process intellectual property (IP) from Semiconductor Manufacturing International Corporation (SMIC). Talus enables designers to address power considerations throughout the flow and within a single environment. Using Talus, SMIC customers can get the best combination of performance, low power and fast turnaround times for complex designs. The reference flow is available now at no cost to Magma customers.