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'Foundry' Category Archive

X-FAB TheKit Process Design Kits for Cadence Virtuoso IC 6.1

Posted by Ken Cheung in Foundry on Tuesday, September 22, 2009

X-FAB Silicon Foundries introduced TheKit process design kits (PDK). TheKit is based on the Cadence Design Systems Virtuoso IC 6.1 custom design platform and SKILL programming language. TheKit is available for all of X-FAB’s process technologies from 1.0 um down to 0.18 um. The process design kit offers a smooth and easy migration from existing [...]

X-FAB XA035 Analog Mixed Signal CMOS Foundry Process

Posted by Ken Cheung in Foundry on Tuesday, September 8, 2009

X-FAB Silicon Foundries introduced the XA035 analog/mixed-signal complementary metal-oxide-semiconductor (CMOS) high-temperature foundry process for integrated circuits (ICs) requiring operating temperatures up to 175 degrees Celsius. The modular 0.35 micrometer process is the first to enable high-temperature-capable system-on-chip (SoC) solutions, combining high-voltage (HV) and embedded non-volatile memory (NVM) elements. The XA035 technology for high-temperature applications is [...]

Magma Talus-based Low-Power Reference Flow for SMIC 65nm Processes

Posted by Ken Cheung in Design Flow,Foundry on Friday, July 24, 2009

Magma Design Automation unveiled a low-power Talus-based IC implementation reference flow for the 65-nanometer process and low-leakage-process intellectual property (IP) from Semiconductor Manufacturing International Corporation (SMIC). Talus enables designers to address power considerations throughout the flow and within a single environment. Using Talus, SMIC customers can get the best combination of performance, low power and [...]

Mentor Graphics Expanded Solution for TSMC Reference Flow 10.0

Posted by Ken Cheung in Design Flow,Foundry on Thursday, July 23, 2009

Mentor Graphics has expanded their set of tools and technologies included in the TSMC Reference Flow 10.0. The expanded Mentor track supports advanced functional verification for complex ICs, netlist-to-GDSII implementation for 28nm ICs, tighter integration with the ubiquitous Calibre physical verification and DFM platform, and tools for layout aware test failure diagnosis. The improved Mentor [...]

TSMC Interoperable Process Design Kit for 65nm Process

Posted by Ken Cheung in Foundry on Thursday, July 23, 2009

Taiwan Semiconductor Manufacturing Company (TSMC) released the first interoperable process design kit (iPDK) for advanced technology. The kit is fully validated on TSMC’s 65 nanometer (nm) process. TSMC unified iPDK works across multiple OpenAccess-based EDA design environments, eliminating the need for multiple proprietary PDKs, and enabling full reuse of design data between different custom IC [...]

SMIC 45nm GP Process

Posted by Ken Cheung in Foundry on Tuesday, June 30, 2009

Semiconductor Manufacturing International Corporation (SMIC) has successfully completed their first 45-nanometer high performance (GP, generic process with high performance) yield lot. The high-speed, high performance 45nm GP technology integrates a silicon germanium stress module into the design. The process enables the device to run faster and make it ideal for system-on-chip, graphics and network processors, [...]

SMIC and Synopsys Reference Flow 4.0

Posted by Ken Cheung in Design Flow,Foundry on Tuesday, June 23, 2009

Synopsys and Semiconductor Manufacturing International Corporation (SMIC) introduced version 4.0 of their 65-nanometer (nm) RTL-to-GDSII reference design flow. The reference flow features support for the Synopsys Eclypse Low Power Solution and IC Compiler Zroute technology. The joint solution gives IC engineering teams a proven reference flow to advance SoC designs targeting SMIC’s 65nm process technology [...]

X-FAB XH018 0.18 Micrometer CMOS Process for Integrated Hall Sensors

Posted by Ken Cheung in Foundry on Wednesday, June 10, 2009

X-FAB Silicon Foundries developed the first foundry process for the production of integrated Hall sensor ICs in 0.18 micrometer technology. The XH018 low-power CMOS process enables the combination of Hall sensor elements with high-voltage devices and Non-Volatile Memory (NVM) options. X-FAB’s XH018 technology for integrated Hall sensor solutions is available today. It comes with comprehensive [...]

LFoundry Process Design Kit for Tanner AMS Electronic Design Software

Posted by Ken Cheung in Foundry on Thursday, June 4, 2009

LFoundry introduced a process design kit (PDK) for A/MS electronic designs. The PDK was developed using Tanner EDA’s HiPer Silicon™ software. LFoundry is providing Tanner EDA users with the LF150 modular 0.15 µm Low Power and RF CMOS process that features up to six levels of aluminium interconnect, a polymide passivation and I/O voltages of [...]

TSMC iRCX Electronic Design Automation Data Format

Posted by Ken Cheung in Foundry on Friday, May 29, 2009

Taiwan Semiconductor Manufacturing Company announced the iRCX interoperable electronic design automation (EDA) data format for TSMC 65nm and 40nm processes. iRCX format unifies interconnect modeling data delivery, ensures data integrity and interpretation. EDA tools which support iRCX format will be able to receive accurate interconnect modeling data from the iRCX files developed and supported by [...]

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