SMIC and Synopsys Reference Flow 4.0
Synopsys and Semiconductor Manufacturing International Corporation (SMIC) introduced version 4.0 of their 65-nanometer (nm) RTL-to-GDSII reference design flow. The reference flow features support for the Synopsys Eclypse Low Power Solution and IC Compiler Zroute technology. The joint solution gives IC engineering teams a proven reference flow to advance SoC designs targeting SMIC’s 65nm process technology [...]
X-FAB XH018 0.18 Micrometer CMOS Process for Integrated Hall Sensors
X-FAB Silicon Foundries developed the first foundry process for the production of integrated Hall sensor ICs in 0.18 micrometer technology. The XH018 low-power CMOS process enables the combination of Hall sensor elements with high-voltage devices and Non-Volatile Memory (NVM) options. X-FAB’s XH018 technology for integrated Hall sensor solutions is available today. It comes with comprehensive [...]
LFoundry Process Design Kit for Tanner AMS Electronic Design Software
LFoundry introduced a process design kit (PDK) for A/MS electronic designs. The PDK was developed using Tanner EDA’s HiPer Silicon™ software. LFoundry is providing Tanner EDA users with the LF150 modular 0.15 µm Low Power and RF CMOS process that features up to six levels of aluminium interconnect, a polymide passivation and I/O voltages of [...]
TSMC iRCX Electronic Design Automation Data Format
Taiwan Semiconductor Manufacturing Company announced the iRCX interoperable electronic design automation (EDA) data format for TSMC 65nm and 40nm processes. iRCX format unifies interconnect modeling data delivery, ensures data integrity and interpretation. EDA tools which support iRCX format will be able to receive accurate interconnect modeling data from the iRCX files developed and supported by [...]
SMIC 65-nanometer Low Leakage Process IP Portfolio
Semiconductor Manufacturing International Corporation (SMIC) announced a set of 65-nanometer low leakage process IPs. SMIC’s new 65nm IPs includes a set of six memory compilers, which enable the intelligent and rapid generation of memory blocks in bulk and on the fly. The compilers feature memories optimized for very high performance and also optimized for performance [...]
SMIC 65nm Standard Cell Libraries
SMIC released three preliminary versions of their 65-nanometer standard cell libraries. The libraries include a high performance Very High Speed (VHS) library, a density and performance optimized High Speed (HS) library, and a power management kit (PMK) for the High Speed (HS) library. The new 65nm standard cell libraries were designed to meet industry standards [...]
Unified Design For Manufacturing Architecture
Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) recently announced the Unified Design For Manufacturing (UDFM) architecture. UDFM targets 32nm process technology and smaller geometries and improves yields, lowers design costs, and accelerates time-to-market and time-to-volume. UDFM provides a unified, encapsulated access to TSMC foundry data and was developed in collaboration with EDA vendors [...]
Intel, Samsung, TSMC Target 450mm Wafer Manufacturing
Intel Corporation, Samsung Electronics, and TSMC are collaboration on the transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications. The companies will cooperate with the semiconductor industry to help [...]
TSMC Multi-layer Mask Service
Taiwan Semiconductor Manufacturing Company, Inc. (TSE: 2330, NYSE: TSM) is offering a multi-layer mask service (MLM) for 90nm, 80nm and 65nm advanced process technologies. MLM service is another mask service TSMC offers beyond multi-project wafer prototyping service, CyberShuttle(SM), and normal production tape-out to enable maximum customer flexibility. MLM is ideal for prototyping single or multi-chip [...]
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