Synopsys Debuts DesignWare HDMI 1.4 PHY IP in 28nm Processes for Multiple Foundries
Synopsys introduced version 1.4 of their DesignWare HDMI (High-Definition Multimedia Interface). The PHY IP is available in advanced 28 nanometer processes for multiple foundries. Availability of DesignWare HDMI 1.4 IP on multiple 28nm processes ensures designers have access to the high-quality, silicon-proven IP so they they can quickly incorporate the latest audio and video functionality [...]
Cadence, Samsung Foundry Develop DFM Flows for 32nm, 28nm, 20nm Chip Design
Cadence Design Systems and Samsung Foundry teamed together to create a design-for-manufacturing infrastructure to produce complex chips. Cadence worked closely with Samsung Foundry to integrate their robust DFM suite. The resulting flows and underlying infrastructure provide a significant competitive edge by enabling engineers to meet tight deadlines while reducing the risk of costly errors.
Cadence Library Characterizer Reference Kit for TSMC Cell Libraries
Cadence Design Systems and TSMC teamed together on a library characterization reference kit. The Cadence Library Characterizer (Altos Liberate) reference kit for TSMC’s standard cell libraries is now available to TSMC customers for download on TSMC-Online. As a result, TSMC customers can now leverage the same technology used in-house at TSMC with the same setup [...]
Mentor Graphics Calibre YieldEnhancer Supports SmartFill Functionality
Mentor Graphics is teaming with TSMC on a SmartFill solution for TSMC’s manufacturing processes starting at 65nm. As a result of the collaboration, Calibre YieldEnhancer product will support SmartFill functionality. The analysis and automatic filling capabilities of the SmartFill solution enables engineers to achieve IC fill constraints with minimal impact on circuit performance in a [...]
Synopsys 28nm Design Solutions for TSMC Reference Flow 12.0
Synopsys introduced 28nm design solutions that integrate manufacturing compliance and system-level prototyping with TSMC Reference Flow 12.0. The extended Reference Flow 12.0 reduces time-to-market and speeds time-to-volume using TSMC’s 28-nm process technology. The design enablement solution features virtual prototyping and high-level synthesis linked to TSMC’s advanced processes, expanded manufacturing compliance capabilities and full support of [...]
Mentor Graphics and Dongbu HiTek Technology Design Kits for Analog BCDMOS
Mentor Graphics and Dongbu HiTek rolled out a series of Technology Design Kits (TDKs). The Technology Design Kits support Dongbu HiTek’s analog-intensive BCDMOS process technologies. The TDKs used with IC Station (Mentor’s Custom IC Design Flow solution) will seamlessly accelerate BCDMOS chip designs from system specifications to post-layout verifications.
Magma, Virage Logic Reference Flow for GLOBAL FOUNDRIES 65nm Process
Magma Design Automation, GLOBALFOUNDRIES, and Virage Logic introduced a Unified Power Format (UPF)-compliant RTL-to-GDSII reference flow. The automated, comprehensive solution streamlines the design and manufacture of ICs that use Virage Logic’s intellectual property (IP) and are manufactured in GLOBALFOUNDRIES’ 65LPe 65-nanometer (nm) low-power process technology. The reference flow is available from Magma, GLOBALFOUNDRIES and Virage [...]
X-FAB XO035 Process for Blu-ray and Optical Data Communication
X-FAB Silicon Foundries announced the XO035 0.35 micrometer process. The XO035 foundry process is optimized for Blu-ray and high-speed optical data communication applications. XO035 includes X-FAB’s blue PIN module. The integration of the PIN diode into the 0.35 micrometer CMOS environment enables the design of high-performance photo detectors. The XO035 process is available now.
Process Design Kits for UMS PH15 and PH25 GaAs MMIC Foundry Processes
AWR and United Monolithic Semiconductors (UMS) introduced enhanced process design kits (PDKs) for the UMS PH15 and PH25 advanced gallium arsenide (GaAs) foundry processes. The enhanced PDKs enable designers to take full advantage of the process capabilities of UMS within AWR’s 2009 Microwave Office design suite including its latest technologies such as iNets, AC0E, AXIEM, [...]
IMEC-TSMC Innovation Incubation Alliance
IMEC and TSMC is forming an Innovation Incubation Alliance to create a platform for enabling the development of product solutions using emerging More-than-Moore technology options. Integrating extra functionalities with foundry CMOS enables customers to compete in emerging markets. By combining IMEC’s expertise in design and technology R&D with TSMC’s excellence in high-volume manufacturing, customers will [...]
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