X-FAB XO035 Process for Blu-ray and Optical Data Communication
X-FAB Silicon Foundries announced the XO035 0.35 micrometer process. The XO035 foundry process is optimized for Blu-ray and high-speed optical data communication applications. XO035 includes X-FAB’s blue PIN module. The integration of the PIN diode into the 0.35 micrometer CMOS environment enables the design of high-performance photo detectors. The XO035 process is available now.
Process Design Kits for UMS PH15 and PH25 GaAs MMIC Foundry Processes
AWR and United Monolithic Semiconductors (UMS) introduced enhanced process design kits (PDKs) for the UMS PH15 and PH25 advanced gallium arsenide (GaAs) foundry processes. The enhanced PDKs enable designers to take full advantage of the process capabilities of UMS within AWR’s 2009 Microwave Office design suite including its latest technologies such as iNets, AC0E, AXIEM, [...]
IMEC-TSMC Innovation Incubation Alliance
IMEC and TSMC is forming an Innovation Incubation Alliance to create a platform for enabling the development of product solutions using emerging More-than-Moore technology options. Integrating extra functionalities with foundry CMOS enables customers to compete in emerging markets. By combining IMEC’s expertise in design and technology R&D with TSMC’s excellence in high-volume manufacturing, customers will [...]
WIN/AWR Process Design Kit for H2W PH50-00 GaAs Foundry Process
AWR and WIN Semiconductors introduced the WIN/AWR H2W PH50-00 process design kit (PDK). The PDK for the WIN PH50-00 GaAs enhancement / depletion-mode pseudomorphic high electron mobility transistor (pHEMT) and heterojunction bipolar transistor (HBT) foundry process is the latest in AWR’s series of PDKs available for monolithic microwave integrated circuit (MMIC) designers. The AWR/WIN PH50-00 [...]
X-FAB TheKit Process Design Kits for Cadence Virtuoso IC 6.1
X-FAB Silicon Foundries introduced TheKit process design kits (PDK). TheKit is based on the Cadence Design Systems Virtuoso IC 6.1 custom design platform and SKILL programming language. TheKit is available for all of X-FAB’s process technologies from 1.0 um down to 0.18 um. The process design kit offers a smooth and easy migration from existing [...]
X-FAB XA035 Analog Mixed Signal CMOS Foundry Process
X-FAB Silicon Foundries introduced the XA035 analog/mixed-signal complementary metal-oxide-semiconductor (CMOS) high-temperature foundry process for integrated circuits (ICs) requiring operating temperatures up to 175 degrees Celsius. The modular 0.35 micrometer process is the first to enable high-temperature-capable system-on-chip (SoC) solutions, combining high-voltage (HV) and embedded non-volatile memory (NVM) elements. The XA035 technology for high-temperature applications is [...]
Magma Talus-based Low-Power Reference Flow for SMIC 65nm Processes
Magma Design Automation unveiled a low-power Talus-based IC implementation reference flow for the 65-nanometer process and low-leakage-process intellectual property (IP) from Semiconductor Manufacturing International Corporation (SMIC). Talus enables designers to address power considerations throughout the flow and within a single environment. Using Talus, SMIC customers can get the best combination of performance, low power and [...]
Mentor Graphics Expanded Solution for TSMC Reference Flow 10.0
Mentor Graphics has expanded their set of tools and technologies included in the TSMC Reference Flow 10.0. The expanded Mentor track supports advanced functional verification for complex ICs, netlist-to-GDSII implementation for 28nm ICs, tighter integration with the ubiquitous Calibre physical verification and DFM platform, and tools for layout aware test failure diagnosis. The improved Mentor [...]
TSMC Interoperable Process Design Kit for 65nm Process
Taiwan Semiconductor Manufacturing Company (TSMC) released the first interoperable process design kit (iPDK) for advanced technology. The kit is fully validated on TSMC’s 65 nanometer (nm) process. TSMC unified iPDK works across multiple OpenAccess-based EDA design environments, eliminating the need for multiple proprietary PDKs, and enabling full reuse of design data between different custom IC [...]
SMIC 45nm GP Process
Semiconductor Manufacturing International Corporation (SMIC) has successfully completed their first 45-nanometer high performance (GP, generic process with high performance) yield lot. The high-speed, high performance 45nm GP technology integrates a silicon germanium stress module into the design. The process enables the device to run faster and make it ideal for system-on-chip, graphics and network processors, [...]
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