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'Components' Category Archive

Freescale Targets Mobile Internet Devices

Posted by Ken Cheung in Components,Wireless on Tuesday, January 8, 2008

Freescale Semiconductor is developing a high-performance audio and power management solution for Intel-based MIDs (Mobile Internet Devices). The highly integrated chipset is designed to efficiently manage power, enabling smaller form factors and longer battery life. The audio and power management chipset will be manufactured on Freescale’s advanced SMARTMOS(tm) technology, a high-voltage CMOS-based process that enables [...]

Altima E2A3GM 832GB 2.5-inch Flash SSD

Posted by Ken Cheung in Components on Monday, January 7, 2008

BiTMICRO Networks announced an 832GB version of the E-Disk® Altima(tm) SATA flash SSD in 2.5-inch form factor. E-Disk® Altima(tm) E2A3GM flash SSD will utilize the multi-level cell (MLC) type of NAND flash, which doubles the number of bits stored per memory cell compared to the single-level cell (SLC) NAND, effectively increasing data density at low [...]

Samsung MLC 128G Solid State Drives

Posted by Ken Cheung in Components on Monday, January 7, 2008

Samsung Electronics Co., Ltd. has developed a multi-level cell (MLC) flash-based 128 Gigabyte (GB) solid state drive (SSD) in 1.8-inch and 2.5-inch versions for mobile applications, notebooks, and desktop PCs. The new drive offers a data writing speed of 70 megabytes per second (MB/s), the industry’s highest for MLC-based SSDs. Samsung expects to begin mass [...]

Samsung Compact Flash Size Spinpoint A1 Hard Drives

Posted by Ken Cheung in Components on Monday, January 7, 2008

Samsung’s Spinpoint A1 30GB and 40GB hard disk drives (HDD) are tiny. Real tiny. Tiny as in Compact Flash tiny. The new drives feature significantly higher storage capacity than conventional memory cards, high shock resistance, and low power consumption. The Spinpoint A1 HDDs are ideal for mobile consumer devices and will fit within the dimensions [...]

Lambda Announces Lifetime Power Supply Warranty

Posted by Ken Cheung in Components on Friday, January 4, 2008

Here’s something you don’t encounter too often. Today, Lambda Europe announced it is offering a lifetime warranty on its HWS series of industrial power supplies. Previously, the HWS series came with a 5 year warranty. The full range of models from 15W to 1500W, including “HD” heavy duty and “ME” medically approved versions are covered [...]

STi7111 HD Set-Top-Box Decoder

Posted by Ken Cheung in Components on Thursday, January 3, 2008

The STi7111, from STMicroelectronics (NYSE:STM), is a new single-chip high-definition set-top box decoder that combines both the demodulation and decoding functions on a single device. The decoder is designed to meet the requirements of major satellite operators worldwide, including DIRECTV. The new chip enables OEMs to target the high-volume market for consumers moving to high-definition [...]

Vishay SiP21301 Linear Regulator Controller

Posted by Ken Cheung in Components on Thursday, January 3, 2008

Vishay Intertechnology, Inc. (NYSE: VSH) created an LDO controller (SiP21301) with adjustable and fixed output voltage options that uses external n-channel MOSFETs to provide extremely low drop-out voltages of under 50 mV at very high currents, up to 7 A, with 80% efficiency. The SiP21301 device is optimized for driving n-channel MOSFETs to power FPGAs, [...]

Texas Instruments TPS61165 High Brightness White LED Driver

Posted by Ken Cheung in Components on Wednesday, January 2, 2008

The new TPS61165, from Texas Instruments Incorporated (TI) (NYSE: TXN), is a high-brightness LED driver with an integrated 40-V, 1.2-A switch that can drive up to three 1-W LEDs in series. The device features an input voltage range of 3-V to 18-V, which enables designers to efficiently manage multiple high-power LEDs used in single-cell, battery-powered [...]

Measurement Specialties Acquires Intersema for $39.7 Million

Posted by Ken Cheung in Components on Wednesday, January 2, 2008

Measurement Specialties, Inc. (Nasdaq: MEAS) has acquired the outstanding capital stock of Intersema for approximately $39.7 million in cash and notes, plus an additional $17.3 million if certain performance thresholds are achieved. MEAS acquired approximately $9.6 million in cash as part of the transaction. The transaction closed December 28, 2007. Intersema Sensoric, which is located [...]

Nextreme Copper Pillar Bump for Flip Chip Packaging

Posted by Ken Cheung in Components on Wednesday, December 19, 2007

Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. The innovation in flip chip process technology addresses two of the most serious issues in electronics today – thermal and power management constraints. Nextreme’s approach uses proven, fully scalable technology to deliver new, enabling functionality [...]

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