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'Components' Category Archive

Kilopass ROM-it! ROM Conversion Option

Posted by Ken Cheung in Components on Friday, July 31, 2009

ROM-it!, from Kilopass Technology, is a read only memory (ROM) conversion option for their One-Time Programmable Memory (OTP) product lines. ROM-it! will eliminate programming test cost for OTP. ROM-it! enables conversion from OTP to ROM with no additional area overhead. The antifuse technology supports a ROM conversion without increasing the bitcell area. All the existing [...]

JESD209-2 LPDDR2 Low Power Memory Device Standard

Posted by Ken Cheung in Components on Thursday, April 2, 2009

JEDEC Solid State Technology Association published the JESD209-2 LPDDR2 Low Power Memory Device Standard. The new standard offers advanced power management features, a shared interface for nonvolatile memory (NVM) and volatile memory (SDRAM), and a range of densities and speeds. The standard will enhance the design of such products as smart phones, cell phones, PDAs, [...]

Embedded SD Standard

Posted by Ken Cheung in Components on Wednesday, December 10, 2008

The SD Card Association (SDA) recently introduced the Embedded SD standard for storage devices in November. The Embedded SD specification extends the widely adopted, market-proven SD interface to embedded storage, doubling device storage potential and easing platform design in mobile handsets and consumer electronics devices. The Embedded SD standard regulates the specifications of SD interface-based [...]

CFast Specification 1.0

Posted by Ken Cheung in Components on Wednesday, December 3, 2008

The CompactFlash Association (CFA) recently released revision 1.0 of the CFast specification. The current CompactFlash PATA (parallel ATA) interface provides up to a 133MB/second interface data rate. The SATA interface will provide interface data rates up to 3Gb/sec as well as compatibility with the SATA disk drive interfaces that are increasingly being used. The CF+ [...]

Jameco Slashes Prices on Electronic Components

Posted by Ken Cheung in Components on Thursday, November 20, 2008

Jameco Electronics has reduced prices from 10% to 40% on more than 80,000 electronic components. Jameco’s price reductions are on top of its tiered pricing strategy, which offers customers three distinct pricing options: (1) name-brand, (2) house-brand, and (3) factory-overrun electronic components. All Jameco products are backed by the company’s low-price guarantee. If customers ever [...]

DDR PHY Interface Specification 2.0

Posted by Ken Cheung in Components on Tuesday, August 19, 2008

Version 2.0 of the DFI specification was recently released. The collaborative technical working group delivered several improvements and enhancements in this latest version of the DFI specification. This version of the specification extends support to include DDR1, DDR2, Mobile, and DDR3 memory; adds read, write, and gate training interfaces; and improves upon the interoperability features [...]

Serial Port Memory Technology Working Group

Posted by Ken Cheung in Components on Wednesday, July 23, 2008

ARM, Hynix Semiconductor, Inc., LG Electronics, Samsung Electronics, Silicon Image, Inc., Sony Ericsson Mobile Communications AB, and ST Microelectronics formed the Serial Port Memory Technology working group to create an open standard for next-generation memory interface technology targeting mobile devices. This first-of-its-kind memory standard for dynamic random access memory (DRAM) will enable extended battery life, [...]

PureDepth Multi-Layer Display

Posted by Ken Cheung in Components on Thursday, May 8, 2008

PureDepth, based in Redwood Shores CA, has developed what they call Multi-layer Display (MLD) technology. PureDepth Multi-Layer Display (MLD[TM]) technology brings real depth to display devices of any size, by layering multiple LCD screens on top of each other and removing interference with an interstitial component. The visual effect is stunning and the possibilities are [...]

Renesas, Sharp, Powerchip Form Joint Venture

Posted by Ken Cheung in Components on Wednesday, April 2, 2008

Renesas Technology Corp., Sharp Corporation, and Powerchip Semiconductor Corp. have established a joint venture that specializes in drivers and controllers for small- and mid-size LCDs. Consolidating the business operations of Renesas Technology and Sharp in this field, the new company will engage in the design, development, sales, and marketing of LCD drivers and controllers. Business [...]

STMicroelectronics STLC2690 Bluetooth and FM Radio Transceiver SoC

Posted by Ken Cheung in Components on Monday, March 24, 2008

STMicroelectronics (NYSE:STM) recently introduced its 4th-generation Bluetooth®/FM Radio combo solution, which meets the demanding integration and cost requirements of the cellular phone market. By combining Bluetooth wireless personal-area-network functionality with an FM radio transceiver in a single 65nm chip, the STLC2690 offers leading-edge integration and performance. The new chip from is manufactured in ST’s low-leakage [...]

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