PureDepth Multi-Layer Display
PureDepth, based in Redwood Shores CA, has developed what they call Multi-layer Display (MLD) technology. PureDepth Multi-Layer Display (MLD[TM]) technology brings real depth to display devices of any size, by layering multiple LCD screens on top of each other and removing interference with an interstitial component. The visual effect is stunning and the possibilities are […]
Renesas, Sharp, Powerchip Form Joint Venture
Renesas Technology Corp., Sharp Corporation, and Powerchip Semiconductor Corp. have established a joint venture that specializes in drivers and controllers for small- and mid-size LCDs. Consolidating the business operations of Renesas Technology and Sharp in this field, the new company will engage in the design, development, sales, and marketing of LCD drivers and controllers. Business […]
STMicroelectronics STLC2690 Bluetooth and FM Radio Transceiver SoC
STMicroelectronics (NYSE:STM) recently introduced its 4th-generation Bluetooth®/FM Radio combo solution, which meets the demanding integration and cost requirements of the cellular phone market. By combining Bluetooth wireless personal-area-network functionality with an FM radio transceiver in a single 65nm chip, the STLC2690 offers leading-edge integration and performance. The new chip from is manufactured in ST's low-leakage […]
MagnaChip MC515ER High Definition CMOS Image Sensor
The MC515ER, from MagnaChip Semiconductor Ltd., is high-definition (HD) ready raw bayer output CMOS image sensor. The MC515ER is a 1.3 megapixel SXGA (1280×1024) resolution raw Bayer output image sensor leveraging an advanced low noise pixel process implemented in MagnaChip's 0.13um CIS process technology. The high quantum efficiency and low read noise enable a Signal […]
Newark Offers 10% Discount on Electronics Parts
Newark, an electronics distributor, is offering an introductory 10% web discount on many of its newly introduced products through March 31, 2008. The promo is part of Newark's launch of their dedicated new products portal. The portal, which will be updated weekly, will feature newly added products, new suppliers, and new-to-market innovations. A detailed description […]
Ambarella A390 HD System on a Chip
The A390, from Ambarella Inc., is a system-on-a-chip (SoC) that simultaneously captures 8 Mpixels still pictures while generating and compressing high-definition (HD) video in either 1080p60 or 1080i60 formats. The device stores still images in either RAW or compressed formats, implementing the JPEG standard at a rate of one picture per second without interrupting full […]
World's Fastest Embedded DRAM
Toshiba Corporation has createded the world's fastest circuit technology for embedded DRAM for System LSI, achieving a speed of 833MHz at 32Mb density. The technology will be applied to graphic processing LSI. Toshiba plans to apply this technology to its leading edge 65nm system LSI process, and to meet market demand for advanced graphic applications […]
High Speed NAND Flash Memory
Intel Corporation and Micron Technology Inc. (NYSE:MU) developed high speed NAND flash memory technology that can greatly enhance the access and transfer of data in devices that use silicon for storage. The new technology – developed jointly by Intel and Micron and manufactured by the companies' NAND flash joint venture, IM Flash Technologies (IMFT) – […]
Smart Mobile Luminance Control Algorithm
MagnaChip Semiconductor Ltd. has developed technology for Smart Mobile Luminance Control (SMLC), which is a low power consuming backlight control algorithm for LCD driver chips. The SMLC algorithm can reduce the luminance of LCD backlights by up to 50% through the analysis of the image data in LCD driver chips and the related adjustment of […]
Power Over eSATA Initiative
Serial ATA International Organization (SATA-IO) recently announced the Power Over eSATA initiative. SATA-IO has begun work on a new specification that will provide power to external SATA (eSATA) devices without the need for a separate power connection. Enhancing eSATA with power delivery will provide a new level of convenience to the designer and the end […]
OKI's Wafer Level Chip Sized Package Service
Oki Electric Industry recently started a contract assembly service for W-CSP (Wafer level Chip Sized Package) semiconductors using through-hole technology. With this new service, sensor and camera module manufacturers can now obtain camera modules that are half the size of conventional modules. Oki plans to increase the production level to 10,000 wafers per month within […]
ARC RealVideo Decoder
ARC International (LSE:ARK) announced the RealVideo® decoder for their Video Subsystem family. The new decoder supports RealVideo content encoded in versions 7, 8, 9 or 10 formats. The next best competitive solution requires 75% more cycles than a member of the ARC Video Subsystem family to decode similar RealVideo bit streams. ARC has contributed the […]
Nextreme Ultra-High Packing Fraction OptoCooler Module
The Ultra-High Packing Fraction (UPF) OptoCooler module, from Nextreme Thermal Solutions(tm), is a new thermoelectric module that addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military, and aerospace applications. The new module has been optimized for laser diode, LED, and advanced sensor products. The UPF OptoCooler removes a maximum of 420 […]
Freescale Targets Mobile Internet Devices
Freescale Semiconductor is developing a high-performance audio and power management solution for Intel-based MIDs (Mobile Internet Devices). The highly integrated chipset is designed to efficiently manage power, enabling smaller form factors and longer battery life. The audio and power management chipset will be manufactured on Freescale's advanced SMARTMOS(tm) technology, a high-voltage CMOS-based process that enables […]
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