Category Archives: Components

assemblies, flash, rom, eprom, dimm, sram, dram, removable media, hard drives, other components

Micron Announces High-Density 45 nm Serial NOR Flash

High-density 45 nm Serial NOR Flash from Micron Technology doubles programming speed and provides improved performance, higher manufacturing efficiency, and a smaller footprint. The MT25Q SPI NOR devices are targeted to consumer, automotive, industrial, and networking applications.

MT25Q features:

  • 512 Mb, 1 Gb, and 2 Gb densities
  • Standard SPI interface
  • 2 MBps programming speed
  • 66 MBps read performance
  • First 2 Gb device in a 6 mm x 8 mm BGA package

Drop-in compatibility with legacy NOR devices make it an option for new and existing designs. Best-in-class 2 MBps programming speed, improved erase performance, and 66 MBps read performance enable quick updates and boot performance. The small package also lends itself to shrinking footprint requirements.

More info: Micron Technology

Vishay Intertechnology Announces Extension to Precision High-Power Thin Film Chip Resistors

Vishay Intertechnology announces extension to precision high-power thin film chip resistors

Discrete semiconductor and passive electronic component manufacturer Vishay Intertechnology’s PHP series of precision high-power thin film chip resistors are now extended to compact 0603 and 0805 cases for power ratings of 0.375 W and 0.675 W. The resistors are optimized for medical imaging, industrial, telecomm, and instrumentation applications.

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Kilopass ROM-it! ROM Conversion Option

ROM-it!, from Kilopass Technology, is a read only memory (ROM) conversion option for their One-Time Programmable Memory (OTP) product lines. ROM-it! will eliminate programming test cost for OTP. ROM-it! enables conversion from OTP to ROM with no additional area overhead. The antifuse technology supports a ROM conversion without increasing the bitcell area. All the existing products can be converted to ROM without altering the aspect ratio. Engineers using XPM can convert their solution today.

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JESD209-2 LPDDR2 Low Power Memory Device Standard

JEDEC Solid State Technology Association published the JESD209-2 LPDDR2 Low Power Memory Device Standard. The new standard offers advanced power management features, a shared interface for nonvolatile memory (NVM) and volatile memory (SDRAM), and a range of densities and speeds. The standard will enhance the design of such products as smart phones, cell phones, PDAs, GPS units, handheld gaming consoles, and other mobile devices by enabling increased memory density, improved performance, smaller size, overall reduction in power consumption as well as a longer battery life.

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Embedded SD Standard

The SD Card Association (SDA) recently introduced the Embedded SD standard for storage devices in November. The Embedded SD specification extends the widely adopted, market-proven SD interface to embedded storage, doubling device storage potential and easing platform design in mobile handsets and consumer electronics devices. The Embedded SD standard regulates the specifications of SD interface-based embedded flash devices, easing the integration of storage devices and avoiding market fragmentation in the mobile and CE industries.

As next-generation mobile handsets and CE devices demand high-capacity embedded storage and flash management solutions, Embedded SD simplifies system engineering by leveraging well-known SD standards. It allows all removable, embedded storage devices and input/output (I/O) peripherals to utilize the same common interface. Embedded SD separates flash management from the host and provides manufacturers and consumers with the flexibility of up to 32 GB scalable high-capacity on-board memory, plus 32 GB of removable memory with any SD High-Capacity memory card.

The Embedded SD specification defines the mechanical and electrical framework of the new embedded form factor and is also focused on enabling advanced functionality in embedded storage devices. Embedded SD devices offer a smart system solution with a smooth migration path from legacy designs, reduced design complexity and support for code, applications and user data storage.

To speed adoption of Embedded SD, support of boot functionality requires only minor changes in the host ROM code of currently mass deployed baseband, application and multimedia processors with minimal additional changes to block device driver to support the additional functionality of embedded SD.

Embedded SD Standard

  • Fully Compatible with SD standard
    Embedded SD is fully compatible with the industry leading SDHC (SD 2.00) interface, ensuring a seamless migration from current SD to Embedded SD designs
  • Both 3.3V and 1.8V Power Supplies
    Supported for both flash and I/O power sources
  • Boot from Embedded SD
    Reliable and secure storage of boot code on an Embedded SD device reduces the number of memory components in a design, as well as the number of busses required, enabling more efficient designs
  • Flexible Partition Mechanism
    Allows multiple physical partitions accommodating varied data sources such as boot code, OS, applications and multimedia content with customizable levels of protection for each partition. Original equipment manufacturers, mobile network operators and content providers gain optimal flexibility and control to configure the Embedded SD device for different usages and data types
  • Protection Mechanism
    Flexibility to separately configure each physical partition with different read and write/erase protection modes
  • Data Robustness
    Optional configuration of each physical partition of the Embedded SD device, including full immunity to power failure and protection of critical data (boot code, operator data, etc.)
  • Power-Saving Sleep Mode
    Option to customize power needs and reduce power consumption and boost battery life

More info: SD Card Association

CFast Specification 1.0

The CompactFlash Association (CFA) recently released revision 1.0 of the CFast specification. The current CompactFlash PATA (parallel ATA) interface provides up to a 133MB/second interface data rate. The SATA interface will provide interface data rates up to 3Gb/sec as well as compatibility with the SATA disk drive interfaces that are increasingly being used.

The CF+ & CompactFlash and CFast standards ensure that today’s and tomorrow’s embedded systems, single board computers, multi-mega pixel DSLR cameras, and other devices will be compatible with faster and even higher capacity CF and CFast cards, as they become available.

CompactFlash cards are currently available up to 48GB with sustained data rates of 45MB/sec. and provide the dominant SSD flash storage solution for embedded systems, single board computers, multi-mega pixel DSLR cameras, and other devices.

In addition to CompactFlash data storage cards, there are CF cards that provide I/O capability. VGA, Ethernet, modem, serial, parallel, digital phone, GSM, Bluetooth, Ethernet wireless, wand & laser barcode scanners, finger print scanners, TV and GPS CF+ cards are all available.

More info: CompactFlash

Jameco Slashes Prices on Electronic Components

Jameco Electronics has reduced prices from 10% to 40% on more than 80,000 electronic components. Jameco’s price reductions are on top of its tiered pricing strategy, which offers customers three distinct pricing options: (1) name-brand, (2) house-brand, and (3) factory-overrun electronic components. All Jameco products are backed by the company’s low-price guarantee. If customers ever find a published price that’s lower than an identical Jameco product, Jameco will not only meet that price, but beat it by an additional 10 percent, right down to the company’s cost.

All Jameco products also come with a 30-day return policy and a 90-day Jameco warranty against any manufacturing defects. The Jameco house-brand products — the Jameco ValueProT line of professional-grade passive, electromechanical and interconnect products; the Jameco ReliaProT line of reliable power supplies and motors; and the Jameco BenchProT line of professional-grade workbench tools — all come with a one-year warranty.

Jameco is a low-price leader for electronic components like digital and analog semiconductors, interconnects, passives, electromechanical, fans, power supplies, prototype/design, test equipment and tools.

More info: Jameco Electronics

DDR PHY Interface Specification 2.0

Version 2.0 of the DFI specification was recently released. The collaborative technical working group delivered several improvements and enhancements in this latest version of the DFI specification. This version of the specification extends support to include DDR1, DDR2, Mobile, and DDR3 memory; adds read, write, and gate training interfaces; and improves upon the interoperability features between the memory controller and a DDR PHY. Chip architects, memory controller vendors, and PHY providers can utilize the new specification to speed their DDR memory system design and integration, and reduces the significant verification costs.

The DFI specification 2.0 is available through a click-thru license. The official version of the specification has been based on the 1.0 foundation of the common interface between DDR-DRAM memory controller logic designs and DDR DRAM physical interface (DDR PHY) designs. This specification allows designers a standard that has wide industry acceptance and ensures that the controller and PHY will work optimally together and no changes will be required to the hardened logic, resulting in reduced cost, time-to-market, and increasing reusable system IP.

More info: DFI Specification

Serial Port Memory Technology Working Group

ARM, Hynix Semiconductor, Inc., LG Electronics, Samsung Electronics, Silicon Image, Inc., Sony Ericsson Mobile Communications AB, and ST Microelectronics formed the Serial Port Memory Technology working group to create an open standard for next-generation memory interface technology targeting mobile devices. This first-of-its-kind memory standard for dynamic random access memory (DRAM) will enable extended battery life, bandwidth flexibility, significantly reduced pin count, lower power demand and multiple ports by using a serial interface instead of the parallel interface commonly used in today’s memory devices. This technology will be ideal for mobile handset manufacturers and consumers because it will dramatically extend battery life while allowing high- performance media-rich applications that will be the norm on next-generation mobile phones.

The SPMT Working Group’s goal is to define a technology that reduces pin count by a minimum of 40 percent, provides a bandwidth range from 3.2GB/s to 12.6GB/s and higher, reduces input/output power by 50 percent or more to extend battery life, and provides the ability to use either a single port or multiple ports into a single SPMT-enabled memory chip. While initially targeted at the mobile handset market, the technology will also be in demand by other markets such as portable media players, digital still cameras and handheld gaming devices.

The Working Group came together to pioneer a new technology to meet the growing demand of manufacturers to extend battery life and increase the performance and functionality of handsets while reducing system cost for the devices. This is in response to mobile service providers’ demand for solutions enabling them to give consumers more data-intensive, media-rich capabilities such as video (including high-definition video), GPS, gaming, Internet access, e-mail, multimedia applications and music at a competitive price. The SPMT Working Group has been meeting since the third quarter of 2007 and is expected to organize a formal consortium later this year consisting of handset, memory and system-on-chip manufacturers and semiconductor IP providers with the intention of bringing the SPMT specification to the industry by the end of 2008.

As DRAM content continues to grow for the new generation of mobile devices, it is becoming increasingly difficult for current technologies to keep up with the demand for longer battery life, greater bandwidth and design flexibility while reducing overall system cost,” said Jim Venable, head of Silicon Image’s Advanced Memory Technology Products. “Serial Port Memory Technology will be a game-changer in the way mobile device developers design new products that deliver significantly better battery life and a higher- quality user experience.

More info: Serial Port Memory Technology (SPMT)

PureDepth Multi-Layer Display

PureDepth, based in Redwood Shores CA, has developed what they call Multi-layer Display (MLD) technology. PureDepth Multi-Layer Display (MLD[TM]) technology brings real depth to display devices of any size, by layering multiple LCD screens on top of each other and removing interference with an interstitial component. The visual effect is stunning and the possibilities are open for computer monitors, televisions, location-based entertainment and mobile devices.

PureDepth Multi-Layer Display

Essentially, the idea is to build displays that are in fact two or more layers of LCD panel that share a common back-light source — as data is displayed on the various layers, a depth effect is created. Optical correlation, compatibility and interferences between display layers are managed via patented interstitial elements within the optical stack of a MLD. Each display panel receives independent control signals and, through the coordination of the images, a true multi-layer visual display is presented to the user. The content of the images, combined with smart coordination can provide remarkable and eye-catching results for static images and even more so with full in-motion video sequences.

The technology lends itself to a broad array of applications. PureDepth is currently actively developing several of these. The company has signed agreements with Samsung for development of displays and mobile handsets, and is also collaborating with SANYO on mobile handsets, gaming technology, and automobile electronics (including in-car navigation).

PureDepth expects to see first products — in gaming — hit the streets during 2008, with more products and applications to follow shortly thereafter.

More info: PureDepth