Texas Instruments introduced the TMDX5502EZDSP and TMDX5509EZDSP development tools for C5502 and C5509A digital signal processors. The TI eZdsp development tools are credit card sized and do not require cables. The C5502 eZdsp development tool features a range of integrated peripheral devices, an XDS100v2 emulator, a complete version of CCS IDE v4 and access to chip support, optimized DSP, image and telecom library with source code. In addition to the features of the C5502 tool, the C5509A eZdsp development tool also includes a USB1.1 slave port and a microSD card slot. The TMDX5502EZDSP is available now for $89 (USD) and the TMDX5509EZDSP is priced at $99 and is also available now.
Kontron announced the Kontron Embedded Application Programming Interface (Kontron EAPI), which is a cross-platform middleware. Thanks to Kontron EAPI, access and control of hardware resources for embedded applications has been standardized. Kontron EAPI is compliant to the PICMG’s EAPI but independent of form factors and operating systems and offers an extended feature set. The first products to feature the new Kontron EAPI are the Kontron embedded motherboard KTQ45, the Kontron COM Express Computer-on-Module nanoETXexpress-SP and Kontron’s MICROSPACE MPCX line of industrial PCs.
The PCI Express Base 3.0 specification is now available to PCI-SIG members. The PCI Express Base 3.0 specification describes the PCI Express architecture, interconnect attributes, fabric management, and the programming interface required to design and build systems and peripherals that are compliant with the PCI Express Specification. PCIe 3.0 technology maintains backward compatibility with previous PCIe architectures and is ideal for high-volume platform I/O implementations across a wide range of topologies (servers, workstations, desktop and mobile personal computers, embedded systems, peripheral devices, etc).
VIA Technologies introduced the AMOS-5000 series device development kits for designing application-specific and fanless Em-ITX-based systems. VIA AMOS-5000 series development kits combine application specific VIA EM-IO expansion modules with specially designed extendable aluminum chassis kits. This enables embedded systems engineers to develop a variety of fanless embedded box systems for a range of applications. VIA AMOS-5000 series development kits are available now.
Microchip Technology introduced the Microstick for dsPIC33F and PIC24H development board, which is a low-cost solution for designing with Microchip’s 16-bit PIC24H microcontrollers and dsPIC33F Digital Signal Controllers (DSCs). Microstick features an integrated USB programmer/debugger that shortens learning curves. Microstick can be used stand-alone or plugged into a prototyping board. The Microstick for dsPIC33F and PIC24H (part # DM330013) is available now for $24.99 each. Educators are eligible for a 25% discount.
Logic announced the AM1808 System on Module (SOM) and the Zoom AM1808 Development Kits for the Texas Instruments Incorporated (TI) AM1808 microprocessor. The Logic AM1808 SOM and development kits can accelerate product development of embedded systems by four to six months. Logic’s AM1808 SOM-M1 and Zoom AM1808 Development Kits are available now. The suggested retail price for the EVM Development Kit is $1,150 and for the eXperimenter Kit is $445.
Leopard Imaging introduced the Leopard Board family of low cost development boards with a free software development kit (SDK) from RidgeRun. The SDKs provide an integrated configuration and build environment as well as the GStreamer audio and video streaming library. The Leopardboard family includes codecs, peripherals, video input and output, software, and support. Both the Leopard Board 355 (LI-LB01) and the Leopard Board 365 (LI-TB01) are available now at the low cost of USD $84 and USD $129 respectively.
According to VDC Research Group, merchant AMC boards revenues will almost double during the next three years. Growth of the merchant AMC board market is projected to be relatively flat through 2010, before significant growth is expected in 2011 and 2012. According to VDC, AMC board shipments have been driven mainly by the use of AMC boards as mezzanines in ATCA systems. The current economic downturn will slow the development of the MicroTCA market. However, MicroTCA systems market is expected to increase significantly in 2011-2012.
Intel Corporation recently unveiled the Extensible Host Controller Interface (xHCI) draft specification revision 0.9 in support of the USB 3.0 architecture, also known as SuperSpeed USB. The xHCI draft specification provides a standardized method for USB 3.0 host controllers to communicate with the USB 3.0 software stack. Interoperability among devices from multiple manufacturers is important for consumer adoption of SuperSpeed USB products. The Intel xHCI draft specification revision 0.9 supports compatibility among various implementations of USB devices and will make it easier to develop software support for the industry.
The xHCI specification describes the registers and data structures used to interface between system software and the hardware, and are developed to be compatible with the USB 3.0 specification being developed by the USB 3.0 Promoter Group. The Intel xHCI draft specification revision 0.9 is being made available under RAND-Z (royalty free) licensing terms to all USB 3.0 Promoter Group and contributor companies that sign an xHCI contributor agreement; information is available online from Intel Corporation.
The Extensible Host Controller Interface specification is intended for hardware component designers, system builders and device driver (software) developers. The reader is expected to be familiar with the current Universal Serial Bus Specification revisions. Note: In case of conflicts between the xHCI and the USB specifications, the USB specifications take precedence and must be followed.
The specification is primarily targeted to host controller developers and system OEMs, but provides valuable information for platform operating system and BIOS device driver developers, adapter IHVs/ISVs, and platform/adapter controller vendors. This specification can be used for developing new products and associated software.
More info: Intel
The 1394 Trade Association recently announced the new 1394 Automotive specification for copper cabling media, designed to optimize the use of the 1394 (FireWire) standard in entertainment, environmental control, camera, and other in-vehicle applications. The new specification extends the original IDB-1394 Automotive Specification to include operation over cost-effective automotive-grade, high-performance copper cabling media. All of the features and mechanisms are provided for high-speed extensions with forward and backward compatibility enabling single-hop distances of up to eight meters through five or more in-line connectors. The specification covers the use of coaxial cable, shielded twisted pair, and shielded twisted quad media for critical non-safety vehicle functions such as multimedia and telematics applications at data rates of 400 Megabit/second or 800 Megabits/second.
The new document includes details on ICs that are compatible and supplemental to the original IDB-1394 Plastic Optical Fiber (POF) products used in hybrid optical and electrical networks. It also applies to ICs for use in embedded vehicle systems networks and to attach clusters of embedded 1394 devices. The new specification also incorporates comprehensive improvements in power management specific to the automotive market.
The original IDB-1394 Automotive standard is an international data networking standard for transmitting video, audio, and other multimedia data over an in-vehicle network. It enables entertainment systems that can play DVDs, show digital TV programming, and provide access to the vehicle navigation system.
Known commercially as FireWire and i.LINK, 1394 has been designed into a wide range of consumer, computer, industrial and other products since its inception, and is now emerging as a vital standard for automotive systems.
More info: 1394 Trade Association