One of the major issues to IC design now and going forward is manufacturing process variations impacting product yield. Achieving high yield means functionally working die while delivering high performance and rapidly getting to market. The typical design flow has inherent issues and as a result, the design for yield (DIY) centric design flow has been developed.
Now that commercial DFY solutions are readily available, allowing designers to analyze yield out to very high sigma values for high dimension cases. This is especially important as the traditional Monte Carlo simulation methods break down from roughly the 4 to 7_+ sigma yield. ProPlus has developed all three components of a DFY solution, including high sigma yield prediction.
Analog circuits used in applications such as:
- Military and aerospace
typically have high sigma design requirements and make them good candidates for high sigma analysis. To learn about some of the basic concepts of DFY including now process variations are classified and modeled, and how it is taken into account during the design process, download this white paper.