ANSYS and Apache Design announced a series of free seminars about simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics. The events will take place in Boston, Massachusetts; Santa Clara and Los Angeles, California; Austin, Texas.
The technical seminars will introduce the latest electronics design technology and simulation breakthroughs that will help engineers design next-generation electronics products. Attendees will be able to see the latest advancements in high-performance computing (HPC) for simulation speed and capacity, as well as hear designers share their experiences meeting power, performance and price targets for their most advanced electronic designs.
Dimensions of Electronic Design Seminar Dates and Locations
- October 11 – Boston
- October 18 – Santa Clara
- October 24 – Los Angeles
- November 1 – Austin
Dimensions of Electronic Design Seminars
The challenges of electronics design are numerous, and many can be formidable: packing greater functionality into smaller portable devices while extending battery life, integrating multiple antennas into a single platform or developing 3D-IC architectures. Join ANSYS and Apache as we introduce our latest electronics design technology and simulation breakthroughs that will help you to design next-generation electronics products.
- Get technology updates on ANSYS HFSS, Apache RedHawk, ANSYS SIwave and more
- See the latest advancements in high-performance computing (HPC) for simulation speed and capacity beyond your expectations
- Learn how the integration of ANSYS and Apache products will revolutionize the design of chip-package-system
- Listen to designers share how they meet power, performance and price targets for their most advanced electronic designs
Register: Low-Power Technology Summit