Mentor Graphics rolled out HyperLynx release 8.2. HyperLynx is a suite of analysis tools for optimizing printed circuit board (PCB) designs. New features include 3D full-wave field solving, and integrated thermal/power co-simulation analysis capabilities. Specialized 3D modeling is required for analysis of multi-GHz SERDES channel interconnects (such as PCIe-Gen 3). The Mentor HyperLynx v8.2 tool suite will ship in volume next month.
HyperLynx r8.2 integrates HyperLynx Thermal analysis with HyperLynx PI (power integrity) for calculating the affects of heat generated by areas of high current density in complex power distribution networks (PDNs) on the PCB. According to Mentor Graphics, this integration enables HyperLynx users to reliably utilize the industry’s most advanced high-speed IC and PCB technologies while developing more competitive products and hitting tight market windows.
It is important to include the 3D effects of certain PCB structures (such as vias) in the signal integrity analysis for digital serial interconnects operating in data rate ranges of 5 to 28Gbps. However, analyzing the complete interconnect using full-wave 3D field analysis would not be practical because the computing times would be excessive. With HyperLynx v8.2 tool suite, analysis is performed with 3D full-wave models for structures such as vias, and with 2D/2.5D solutions for constructs such as traces. This results in fast and accurate full interconnect analysis.
Another effect of today’s more advanced, high-performance designs is the necessity for multiple and complex power distribution networks due to the increasing number of supply voltages. This complexity can result in neck-down areas of copper on the PCB and high current densities which can then lead to excessive copper heating and, in severe cases, copper failure. The HyperLynx PI product now includes co-simulation between power integrity DC and thermal analysis to reflect the combination of heating of the PDNs and heat dissipation from the components, and the increased copper resistivity due to this heating. These integrated products now alert the designer to possible product failures due to excessive heat, as well as possible signal/power integrity performance issues.
More info: Mentor Graphics Corporation