New Cadence Book: Advanced Verification Topics

Cadence Design Systems published a new book: Advanced Verification Topics. The 229-page book describes the latest techniques and methodologies for verifying today’s most complex IP and systems on chips (SoCs). It discusses topics like metric-driven verification of digital and mixed-signal designs, low-power verification using the UVM, multi-language UVM, and acceleration for the UVM. The Cadence book is ideal for aid verification engineers. It builds on a prior Cadence book, A Practical Guide to Adopting the Universal Verification Methodology (UVM).

Advanced Verification Topics was written by eight Cadence verification experts. Advanced Verification Topics will be an important reference book for teams responsible for verifying complex mixed-signal IP and SoCs that utilize low-power, verification IP (VIP), transaction-level models (TLM), acceleration, and similar techniques to reduce risk while getting end products into working silicon faster.

Advanced Verification Topics

The Accellera Universal Verification Methodology (UVM) standard is architected to scale, but verification is growing and in more than just the digital design dimension. It is growing in the SoC dimension to include low-power and mixed-signal and the system integration dimension to include multi-language support and acceleration. These items and others all contribute to the quality of the SOC so the Metric-Driven Verification (MDV) methodology is needed to unify it all into a coherent verification plan. This book is for verification engineers and managers familiar with the UVM and the benefits it brings to digital verification but who also need to tackle specialized tasks. It is also written for the SoC project manager that is tasked with building an efficient worldwide team. While the task continues to become more complex, Advanced Verification Topics describes methodologies outside of the Accellera UVM standard, but that build on it, to provide a way for SoC teams to stay productive and profitable.

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