2011 International Symposium on Quality Electronic Design

The 2011 International Symposium on Quality Electronic Design (ISQED) features seven keynote speeches, poster sessions, nine tutorials, over 100 technical presentations, and exhibits. The conference will take place March 14-16 at the Hyatt Regency Hotel in Santa Clara, CA. The event is co-located with Sematech’s Design for Reliability Workshop (Stress Management for 3D ICs Using Through Silicon Vias) and the International Electronic Design Education Conference (IEDEC). the ISQED keynote speeches and exhibits are free and open to all.

ISQED Tutorials and Presentations

  • Holistic Approach to Low Power Design: Best Practices and Opportunities with Emerging Technologies
  • SRAM and Logic Circuit Techniques for Low Power Design in 32nm and Below
  • Automated Design and Porting of Analog/Mixed-signal Circuits
  • Current and Electric Field Induced Switching of Ferromagnets for Low-power Memory Applications
  • Application of Spintronics for MRAM and Memristor-based Computing
  • Hybrid Electrical Energy Storage Systems
  • System Level Power Management for Cellular Chipsets
  • Design for manufacturing (DFM) Innovations and advances for IC Design
  • Multitechnology Hyperintegration Platform: the technology crystal ball
  • For how much longer can Moore’s Law hold?
  • Device Aging: Analysis and Design
  • Analog and 3D ICs
  • Low Power Circuits, Sensors, and Memory
  • Modeling, Abstraction, and Verification of Industrial Flash Memories
  • Virtual Prototyping for HW-SW co-verification and co-debugging in a multi processor, complex chip designs
  • Lithography and 3D Integration
  • New Ideas in Digital Design Automation
  • System frameworks and tools
  • Stress Management for 3D ICs using Through-Silicon-Vias
  • Variation and Noise Aware Design
  • Physical Design Issues in Custom Circuits and FPGAs
  • Verification Validation and Test
  • Verification of Power Managed Wireless SoCs
  • Ensuring Known Good IP for Successful IC Development
  • The State of 3D Circuit Integration and Its Effect on Design
  • Enabling the Smart-Connected Home
  • Variation, Reliability, and Test
  • Package co design for reliability and signal/Power Integrity
  • System Design Considerations
  • Electronic Design Education Conference
  • Signoff-driven Custom Physical Design
  • Error Resilient Design
  • Routing, Signal Integrity, and Timing Closure
  • Power Delivery and Estimation
  • Design Methodologies for CMOS and Beyond
  • Advanced Devices and Manufacturing Technologies
  • New Ideas in Analog Design Automation

More info: ISQED 2011 Conference Registration