Toshiba America Electronic Components (TAEC) and Denali Software are offering a webinar titled, eMMC-based Memory Architectures: Trends, Design Considerations and Trade-offs. The webcast will review the new features of eMMC v4.4, and discuss how it can be integrated into mobile phones or other CE device in multiple ways such as a discrete eMMC device, a DRAM+SLC+eMMC multi chip package (MCP), DRAM + eMMC MCP or a package on package (POP) stacked device.
The online seminar will be presented by Scott Beekman, senior manager, Mobile Memory for TAEC. He will discuss why one might want to go with one packaging solution over another, and how the new partitioning capabilities can eliminate the requirement for a separate SLC NAND device, using the requirements of a smartphone as an example.
High density NAND embedded memory solutions are enabling new capabilities in mobile phones and consumer electronics devices. The JEDEC/MMCA standard for embedded MultiMediaCards (eMMC) defines a standard interface for a simple read/write memory using an MMC controller with MLC NAND flash that can be configured as either MLC NAND (two-bit per cell) for economical data storage or as pseudo SLC NAND (one-bit per cell) for code storage. This standard has been growing in popularity over the past few years.
The latest version, e-MMC V4.4, offers additional flexibility in partitioning MLC vs. SLC storage areas, new security and write protection capabilities, and simplifies embedding in products, to help reduce development burdens on product manufacturers. It is applicable for use in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras.
Toshiba America Electronic Components is one of the first companies to offer a 64GB eMMC module compliant with the JEDEC/MMCA Version 4.4.
More information: e-MMC based Embedded Memory Architectures Webinar