SEMATECH Surface Preparation and Cleaning Conference
SEMATECH’s Surface Preparation and Cleaning Conference (SPCC) will feature advanced technologies for cleaning, measuring and processing new III-V semiconductor materials for volume wafer manufacturing. SPCC 2010 will focus on particle removal, including next-generation materials, controlling processes to minimize impact on fragile device structures, non-damaging methods to remove resist, and new metrology approaches for measuring passivation and surface defects. SPCC will take place March 22-24, 2010 at the Sheraton Austin Hotel.
SEMATECH Surface Preparation and Cleaning Conference
- Surface Preparation and Cleaning: Fundamentals
- Upcoming Challenges in Transistor Scaling
- New Surface Preparation and Clean Challenges
- Dry Etch Processing of Microelectronic Devices with HF/H2O/Supercritical CO2
- Investigation of Wet Etch of sub-nm LaOx Capping Layers for CMOS applications
- Bond pad Surface Quality for Reliable Wire Bonding
- MOSFETs – Opportunities and Challenges
- Surface-Sensitive Characterization Techniques for High Mobility Channel Materials
- Water Management on Semiconductor Surfaces
- Nanoscale Particle Removal Using Wet Laser Shockwave Cleaning
- Controllable Collapsing Bubbles as a Novel Approach for NANO Scale Wafer Cleaning and Surface Preparation
- Control Of Sonoluminescence Signal In Di Water Using Carbon Dioxide
- Controlled DI Water CO2 Gasification to Eliminate ESD Effects and Corrosion – Control of Contamination, Development in Equipments
- Atmospheric EHD Cleaning Chamber Yields High PRE
- Panel Discussion: Next Generation Particle Removal
- Opportunities for Recycling and Reclaiming Fab and Assembly Test Facility Wastewaters – A Benchmarking Study
- Chemical Supply Cost Reduction: Gauging today’s Risk in Modern Fabs
- Challenges on BEOL Wafer Cleaning
- The Effects of Surface Roughness and Chemistry on SiO2 and Low-k Film Wetting
- Why Are Formulated Products Necessary and How Does One Design a Commercially Successful Cu Post-CMP Cleaner?
- Additives to Reduce Small Particle Defects in Post-CMP Cleaning
- Charge-Induced Attraction of Particles in Post CMP and Megasonic Clean Processes
- Evaluation of Cleaning Procedure for the Detection of Scratches Formed on Oxide Wafer during CMP Process
- Cold Implanted Resist Modeling
- All-Wet Removal of Post-Etch Photoresist and Sidewall Residues: Electrical Characterization of 90 nm and 30 nm ½ Pitch Structures
- Thermal Wafer for WETS Optimization
- Pushing the Piranha Chemistry to Strip Higher Dosed Photoresist
- Post-Etch Sidewall Residues in Metal Hard Mask/Porous Low-k Single Damascene Structures: Characterization and Wet Removal
More info: SEMATECH Surface Preparation and Cleaning Conference
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