SEMATECH Surface Preparation and Cleaning Conference

SEMATECH’s Surface Preparation and Cleaning Conference (SPCC) will feature advanced technologies for cleaning, measuring and processing new III-V semiconductor materials for volume wafer manufacturing. SPCC 2010 will focus on particle removal, including next-generation materials, controlling processes to minimize impact on fragile device structures, non-damaging methods to remove resist, and new metrology approaches for measuring passivation and surface defects. SPCC will take place March 22-24, 2010 at the Sheraton Austin Hotel.

SEMATECH Surface Preparation and Cleaning Conference

  • Surface Preparation and Cleaning: Fundamentals
  • Upcoming Challenges in Transistor Scaling
  • New Surface Preparation and Clean Challenges
  • Dry Etch Processing of Microelectronic Devices with HF/H2O/Supercritical CO2
  • Investigation of Wet Etch of sub-nm LaOx Capping Layers for CMOS applications
  • Bond pad Surface Quality for Reliable Wire Bonding
  • MOSFETs – Opportunities and Challenges
  • Surface-Sensitive Characterization Techniques for High Mobility Channel Materials
  • Water Management on Semiconductor Surfaces
  • Nanoscale Particle Removal Using Wet Laser Shockwave Cleaning
  • Controllable Collapsing Bubbles as a Novel Approach for NANO Scale Wafer Cleaning and Surface Preparation
  • Control Of Sonoluminescence Signal In Di Water Using Carbon Dioxide
  • Controlled DI Water CO2 Gasification to Eliminate ESD Effects and Corrosion – Control of Contamination, Development in Equipments
  • Atmospheric EHD Cleaning Chamber Yields High PRE
  • Panel Discussion: Next Generation Particle Removal
  • Opportunities for Recycling and Reclaiming Fab and Assembly Test Facility Wastewaters – A Benchmarking Study
  • Chemical Supply Cost Reduction: Gauging today’s Risk in Modern Fabs
  • Challenges on BEOL Wafer Cleaning
  • The Effects of Surface Roughness and Chemistry on SiO2 and Low-k Film Wetting
  • Why Are Formulated Products Necessary and How Does One Design a Commercially Successful Cu Post-CMP Cleaner?
  • Additives to Reduce Small Particle Defects in Post-CMP Cleaning
  • Charge-Induced Attraction of Particles in Post CMP and Megasonic Clean Processes
  • Evaluation of Cleaning Procedure for the Detection of Scratches Formed on Oxide Wafer during CMP Process
  • Cold Implanted Resist Modeling
  • All-Wet Removal of Post-Etch Photoresist and Sidewall Residues: Electrical Characterization of 90 nm and 30 nm ½ Pitch Structures
  • Thermal Wafer for WETS Optimization
  • Pushing the Piranha Chemistry to Strip Higher Dosed Photoresist
  • Post-Etch Sidewall Residues in Metal Hard Mask/Porous Low-k Single Damascene Structures: Characterization and Wet Removal

More info: SEMATECH Surface Preparation and Cleaning Conference