Co-Design Solutions – Bridging the Gap from Silicon to System

At the Microelectronics Packaging and Test Engineering Council (MEPTEC) Technical Symposium, Apache Design Solutions will take part in a technical session, Co-Design Solutions – Bridging the Gap from Silicon to System. The session will focus on fast 3D EM simulations. MEPTEC takes place in San Jose, California, on Thursday, February 25.

During the session, Dr. Ji Zheng, Director of Chip-Package-System at Apache, will present a paper, Fast 3D EM Simulation for Digital System Designs. The paper will present the various methodologies for multi-domain analysis and discuss a complete die modeling technique, including core and I/Os, that will enable system-level EM simulation for power, signal integrity, and EMC.

The MEPTEC is a leading forum for packaging and test professionals to learn and exchange ideas that relate to microelectronic assembly, test and handling. The quarterly Technical Symposiums allow industry professionals to focus on the latest and most high-profile topics facing the industry today.

More info: Apache Design Solutions