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Sigrity PowerDC Thermal Simulation and Analysis Software

Posted by Ken Cheung in Models, Simulations on Thursday, January 28, 2010

Sigrity introduced PowerDC Thermal analysis software. PowerDC Thermal eliminates manual iterations between simulations with separate electrical and thermal tools, reduces time, and improves results convergence. It is ideal for avoiding field failures. PowerDC with DC analysis, thermal analysis, and co-simulation capability is available on Windows and Linux platforms. Annual prices start at $30,000. PowerDC Thermal also is available as an added option for currently licensed Sigrity PowerDC users. It adds thermal analysis and co-simulation to the present DC analysis capability. Annual prices start at $15,000.

PowerDC thermal simulation fully considers both die heating and copper heating on the package and the board, and also takes temperature and location dependencies into account. Such precision simulation has not been available until now. Up to this point, design teams either have relied on overly pessimistic IPC peak temperature estimates, or thermal simulations that fail to fully account for the critical impact of high current density.

The PowerDC automated environment with co-simulation maximizes accuracy by leveraging powerful electrical current density analysis, computing accurate thermal temperature distributions, and iterating on the combined effects. Thus, it fully considers factors such as the increasing electrical resistance at higher operating temperatures. Similarly, the converged results accurately reflect the impact of the increasing component power dissipation that takes place as temperatures rise.

Design files from many printed circuit board and IC package layout systems can be imported seamlessly into Sigrity’s electrical / thermal co-simulation environment. In addition, the die model from popular IC design tools can be included. Analysis can proceed on designs that are partially or fully placed and routed. The comprehensive simulations account for complex plane shapes, including cut-outs, wires, solder balls, solder bumps, and via structures to maximize accuracy. Sigrity’s unique task-based workflow and the included constraint manager simplify set-up and make results easy to interpret. A range of reporting options as well as electrical and thermal color maps enable users to see the converged results so they can rapidly pinpoint improvement options.

More information: Sigrity

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